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Product category: Programmable Logic Devices
News Release from: Lattice Semiconductor UK
Edited by the Electronicstalk Editorial Team on 26 October 2004

Lead free packaging gains in popularity

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Lattice Semiconductor has already shipped more than 5 million lead-free components, and continues to see a rapidly growing customer demand for these products.

Lattice Semiconductor has already shipped more than 5 million lead-free components, and continues to see a rapidly growing customer demand for these products Lattice began shipping lead-free (Pb-free) components in 2001, and formally announced the launch of its lead-free product portfolio in February 2004

Shipping volume of lead-free devices has increased 290% since the beginning of 2003.

Lattice offers the industry's broadest standard, off-the-shelf lead-free PLD product portfolio, including simple programmable logic devices (SPLDs), complex programmable logic devices (CPLDs), field programmable gate arrays (FPGAs), field programmable system chips (FPSCs), programmable analogue devices, programmable clock generators and programmable digital interconnect devices, with more than 560 standard lead-free ordering part number (OPN) combinations.

All new products introduced by Lattice in the future will also be supported in lead-free configurations.

All Lattice lead-free products are also RoHS (Restrictions on the use Of Hazardous Substances) compliant.

"We are proud to be the programmable logic industry leader in lead-free product development", said Randy Baker, Lattice Vice President of Manufacturing.

"We are committed to conducting business in a manner consist with the efficient use of resources and materials, and the preservation of the natural environment".

Lattice has qualified a wide variety of package types in lead-free configurations.

These qualified packages include the thin quad flatpack (TQFP), fine pitch BGA (fpBGA), fine pitch super BGA (fpSBGA), chip scale BGA (csBGA) and quad flatpack (QFN).

Product families currently supported in lead-free configurations include: LatticeECP-DSP and LatticeEC low-cost FPGAs (1.2V); ispXPLD 5000MV/MC devices (3.3/1.8V); ispXPGA nonvolatile reprogramable FPGAs (3.3/2.5/1.8V); ispPAC-Power 1208/604 power managers; ispClock5500 clock generator and universal fan-out devices; ispGDX2 high performance digital crosspoint switches (3.3/1.8V); Orca field programmable system chips (FPSCs); ispMach 4000V/C CPLDs (3.3/1.8V); ispMach 4000Z CPLDs (1.8V zero power); and ispGAL 22V10AV devices (3.3V GAL).

All Lattice lead-free TQFP and QFN packages are backward compatible with conventional leaded manufacturing methodologies.

This backward compatibility allows users to surface mount Lattice lead-free packages onto lead-based PCBs, and/or use Lattice lead-free packaging with leaded solders.

This capability greatly simplifies the inventory management challenges associated with the migration from a conventional lead-based to a lead-free manufacturing environment.

Lattice lead-free packages are currently qualified to Level 3 moisture resistance with peak reflow temperatures of 245, 250 or 260C, depending on the package configuration and consistent with IPC/JEDEC J-STD-020, "Moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices".

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