Socket saves space on back-to-back BGAs

Ironwood Electronics' new high performance SG-BGA-6130 socket combo allows 1mm-pitch 3528-position BGA ICs to be used without compromising performance in very high speed applications.

Ironwood Electronics' new high performance SG-BGA-6130 socket combo allows 1mm-pitch 3528-position BGA ICs to be used without compromising performance in very high speed applications where the devices are assembled back to back on to the target PCB.

The new gigahertz bandwidth socket combo easily supports high pin count BGA devices using a high performance conductive elastomer connector.

The contact resistance is normally 10mohm.

The sockets have a precision design, which guides the IC to the exact position for connection of each ball and uses aluminium heatsink screws to provide compressive force to ensure full electrical contact.

The socket shown in the picture is SG-BGA-6130 for 42.5mm IC body size.

The socket combo accommodates IC packages such as the Xilinx FF1704 BGA, 1mm pitch, 42 x 42 arrays.

When large BGAs are mounted back to back, the amount of PCB circuitry for chip-chip interconnect is greatly reduced and PCB wiring loading is also reduced.

These patented ZIF socket combos are simply mechanically mounted to the target PCB (both component and solder sides).

The socket lid is twisted open, the IC is inserted, the lid is closed and aluminium heatsink screw is rotated to provide downward force on the IC.

The individual socket is 8.48mm high and only 2.5mm per side larger than the actual IC packages, minimising footprint on system boards while maximising system speeds.

These sockets are also designed to accommodate filter capacitors closest to the BGA pads.

The socket body and heat sink screw are constructed with aluminium to facilitate heatsinking.

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