BGA socket handles high-bandwidth signals

Edited by the Electronicstalk editorial team Dec 14, 2004

Ironwood Electronics' SG-BGA-7026 allows 0.5mm-pitch, 11 x 11mm body ICs to be used in socket and operate without compromising performance in very high speed computing and comms applications.

New from Logic Technology, the Ironwood Electronics SG-BGA-7026 allows 0.5mm-pitch, 11 x 11mm body ICs to be used in socket and operate without compromising performance in very high speed computing and comms applications.

The new 10GHz-plus bandwidth sockets easily support very dense BGA stacked devices using a high performance conductive elastomer contactor.

The contact resistance is normally 10mohm.

The sockets have a precision design, which guides the IC to the exact position for connection of each ball and uses an aluminium heatsink screw to provide compressive force.

The socket accommodates IC packages such as the Amkor MAF223 BGA, 0.5mm pitch, and arrays with up to 400 balls.

The socket requires no solder and no mounting holes and requires only 1.25mm perimeter space for the socket body on the target PCB These patented ZIF sockets are simply mounted to the target PCB by an epoxy band around the perimeter.

The socket is placed into position with a precision alignment tool and epoxied in place.

There are special grooves on the socket wall for additional epoxy strength.

The contactor can be easily replaced after hundreds of cycles.