Micro-BGA adapter aids prototyping
Design engineers using 0.5mm-pitch 84-position micro-BGA ICs will be interested in the PA-BGA84C-P-Z-01 prototyping adapter from Ironwood Electronics.
Design engineers using 0.5mm-pitch 84-position micro-BGA ICs will be interested in the PA-BGA84C-P-Z-01 prototyping adapter from Ironwood Electronics.
This adapter is a part of Ironwood Electronics' new high performance product line that allows quick prototyping of micro-BGA packaged ICs without complicated circuit board design.
This prototyping adapter comes with a high speed gigahertz socket which provides easy access to all signals and simplifies IC swap out.
This adapter interfaces the 84-position gigahertz BGA socket to a 0.100in centre pin grid array (PGA).
The gigahertz socket allows 0.5mm pitch Intel VFBGA 84-ball package ICs to be used in socket and operate without compromising performance in very high performance memory applications.
The new 10GHz bandwidth sockets easily support very dense BGA devices using a high performance conductive elastomer contactor.
The contact resistance is normally 10mohm.
The sockets have a precision design, which guides the IC to the exact position for connection of each ball and uses an aluminium heatsink screw to provide compressive force.
The socket shown in the picture is for 6 x 6mm IC body size.
The socket accommodates IC packages such as the Intel VFBGA, 0.5mm pitch, and 10 x 10 arrays with up to 100 balls.
The socket is mechanically mounted to the adapter board.
A spacer board on the bottom side of adapter acts as both backplate for the socket and as standoff for the complete adapter.
The adapter board uses 3mil line/space PCB technology.
The bottom interface of adapter is constructed with gold plated machined terminal pins for maximum reliability for socketing as well as soldering to the target PCB.
In addition, the adapters can be supplied with wire-wrap pins so the prototype can be built on very inexpensive wire-wrap panels.
The sockets are available now from Logic Technology.
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