Product category:
Communications ICs (Wireless)
News Release from: Link Microtek | Subject: TQM7M4006
Edited by the Electronicstalk Editorial
Team on 04 July 2005
Quad-band power amp shrinks for handsets
A new quad-band power-amplifier module claims a breakthrough in size reduction while maintaining fully matched specification-compliant high-efficiency performance.
New from Link Microtek, the TriQuint Semiconductor TQM7M4006 is a quad-band power-amplifier module (PAM) that represents a breakthrough in size reduction while maintaining fully matched specification-compliant high-efficiency performance Designed for mobile handset applications, the TQM7M4006 features a compact 5.0 x 5.0 x 1.1mm form factor, which is 30% smaller than any other quad-band GSM PAM on the market
This article was originally published on Electronicstalk on 4 Jan 2002 at 8.00am (UK)
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Despite its very compact sise, the module achieves exceptional efficiency across the 824-849, 880-915, 1710-1785 and 1850-1910MHz bands.
This advanced 3V module is GPRS Class 12 compatible and sets new standards in performance and size by employing the latest technologies in power amplifier design.
High reliability is assured by TriQuint's InGaP HBT technology in combination with new CuFlip (flip-chip) assembly technology.
Providing a simple 50ohm interface on all input and output ports, this fully integrated module includes a highly stable onboard reference voltage and internal closed-loop power control with a wide dynamic range of 55dB.
No external matching or bias components are required.
The TQM7M4006 is housed in a low-profile LGA package and incorporates two InGaP power-amplifier die, a CMOS controller and an integrated GaAs passive die.
All four die are CuFlip mounted to minimise thermal excursions.
Each amplifier has three gain stages, and interstage matching is implemented with High Q passives technology for optimal performance.
Minimum output power is specified as +34.2dBm for GSM bands and +32.0dBm for DCS/PCS bands.
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