Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Link Hamson | Subject: High-temperature green polyimide labels
Edited by the Electronicstalk Editorial
Team on 31 August 2007
Assembly labels resist high temperatures
Use of a green high-temperature label at the start of the process reduces both the number of labels required, and the number of label placements, providing a significant cost saving.
Link Hamson has released high-temperature green polyimide labels for simpler and lower cost identification of lead free assemblies PCB assemblers have for some years used white gloss high-temperature labels for product identification from the start of the production process
This article was originally published on Electronicstalk on 31 Oct 2007 at 8.00am (UK)
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At the time of the introduction of lead-free soldering a second label, most likely green, was added after the high-temperature processes.
This label was unable to withstand difficult process conditions, but is required to indicate the assembly is lead-free.
Use of a green high-temperature label at the start of the process reduces both the number of labels required, and the number of label placements, providing a significant cost saving.
The green polyimide labels withstand temperatures up to 300C and are suitable for identification in harsh environments.
The labels may be printed with different thermal transfer ribbons so as to remain legible after various cleaning operations.
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