Product category:
PCB Assembly Equipment and Tools
News Release from: Link Hamson | Subject: Martin Reball 03
Edited by the Electronicstalk Editorial
Team on 06 December 2007
Reballing unit resurrects old BGAs
Component costs can be minimised by the re-use of BGAs, but before BGAs can be re-used their solder balls must be replaced.
Available now from Link Hamson, the Martin Reball 03 BGA reballing unit provides well proven Martin reballing technology in a convenient and cost effective stand alone unit A major advantage is that a single toolset can be used to deal with a diverse range of BGAs, and each reballing process takes only about 3 minutes
This article was originally published on Electronicstalk on 31 Aug 2007 at 8.00am (UK)
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Component costs can be minimised by the re-use of BGAs, but before BGAs can be re-used their solder balls must be replaced.
To do this a number of tools used to be required, a stencil of the correct sise and ball pitch, a mini oven of the correct size, and a hot air pen with control unit.
The Reball 03 comes complete with a BGA holder, seven adapters and stencils for customisation with Kapton tape.
This reduces the number of items required compared with previous methods, and offers a lower cost solution for companies with limited budgets and differing applications.
The simple Teach function is used to allow the system to calculate the duration of the reballing process.
It's done with the touch of a few buttons; first selection of process temperature and program number, then insert BGA and close lid, signal when the melting point is achieved by pressing the stop button, and then the system calculates the time required for a reliable solder joint.
It then stores the data in one of eleven programs for repeat operations.
The lid of the Reball 03 automatically opens and cooling starts with the integrated fan.
The BGA is ready for re-use.
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