Product category:
Circuit Protection Devices
News Release from: Littelfuse UK | Subject: TVS, ESD, Automotive and High Speed varistors
Edited by the Electronicstalk Editorial
Team on 15 March 2004
Surface-mount varistors cover the field
Four new series of surface mount multilayer metal oxide varistors are ideal for protecting a wide variety of electronic circuits and components.
Four new series of surface mount multilayer metal oxide varistors are ideal for protecting a wide variety of electronic circuits and components To match specific soldering operation requirements, they incorporate nickel/tin terminations, greatly increasing life and storage time compared to components with the usual palladium or platinum-plated terminals
This article was originally published on Electronicstalk on 24 May 2005 at 8.00am (UK)
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The TVS series supports the widest range of applications with operating voltages from 3.5 to 120V DC and peak current ratings of up to 2000A (8/20us).
Offering protection against surges, electronically fast transients, electrostatic discharge and other transient events, they are available in sizes of 0402, 0603, 0805, 1206, 1210, 1812 and 2220.
Designed to protect against lower energy transients, the ESD (electrostatic discharge) series is characterised for high-frequency applications.
These suppressor/filter devices can be applied in circuits with working voltages up to 18V DC and are offered in 0402, 0603, 0805 and 1206 packages.
The Automotive series protects modules and electronic devices from the secondary load dump and other transients found in the automotive environment.
Working voltage is 18V DC and sizes are 0805, 1206, 1210, 1812 and 2220.
Specifically designed for extra-low-capacitance (3 and 12pF) applications, the High Speed series is ideal for protecting both analogue and digital circuits where they will not distort or attenuate the data signal.
These varistors are available in 0402 size.
The patented manufacturing process involves interleaved layers of semiconductor-based dielectric materials and metal electrodes being alternately screened onto a substrate (subwafer), the number of layers and dielectric materials varying with the different types of component.
This subwafer is divided into the individual devices and sintered onto homogeneous ceramic.
Metal end terminations are then applied and fired, completing the operation.
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