http://www.electronicstalk.com/news/lod/lod000.html Lord Corporation news releases on Electronicstalk en-gb Copyright (C)2008 Pro-Talk Ltd. All rights reserved. Sat, 22 Nov 2008 08:00:00 UT Sat, 22 Nov 2008 08:00:00 UT http://www.pro-talk.com/images/protalklogo90.gif http://www.pro-talk.com/ 90 79 Lord Corporation has developed the 8600 series of polymer resistor systems as an alternative to ceramic high temperature materials (Cermet) for potentiometer applications. Fri, 12 Sep 2008 08:00:00 UT Lord Corporation http://www.electronicstalk.com/news/lod/lod109.html New material is ideal for automotive and consumer electronics and has been tested for use by a variety of customers. Fri, 25 Jul 2008 08:00:00 UT Lord Corporation http://www.electronicstalk.com/news/lod/lod108.html Solvent-free thermal greases require fewer processing steps and improve thermal dissipation over comparable compounds. Thu, 24 Jul 2008 08:00:00 UT Lord Corporation http://www.electronicstalk.com/news/lod/lod107.html Polymer-based adhesive removes the need to apply separate adhesive and thermal interface material in die lid attach applications. Wed, 23 Jul 2008 08:00:00 UT Lord Corporation http://www.electronicstalk.com/news/lod/lod106.html Specifically formulated material increases reliability of in-package and chip-on-board applications by increasing the thermal dissipation from the die into the substrate. Tue, 22 Jul 2008 08:00:00 UT Lord Corporation http://www.electronicstalk.com/news/lod/lod105.html Two-comportment silicone elastomer solution enables a new technology to protect mission-critical electronic components from damage due to heat, shock and vibration. Wed, 12 Dec 2007 08:00:00 UT Lord Corporation http://www.electronicstalk.com/news/lod/lod104.html Simply specifying a chemistry presupposes a solution without a review of other complex factors and specific performance requirements, which will likely result in a suboptimum solution. Wed, 19 Sep 2007 08:00:00 UT Lord Corporation http://www.electronicstalk.com/news/lod/lod103.html ME-532 flip chip underfill is specifically formulated to achieve high reliability for in-package or chip-on-board applications where fast flow under large chips is required. Tue, 28 Aug 2007 08:00:00 UT Lord Corporation http://www.electronicstalk.com/news/lod/lod102.html Lord Corporation has set up a new network to distribute its industrial electronics products and technologies. Fri, 04 May 2007 08:00:00 UT Lord Corporation http://www.electronicstalk.com/news/lod/lod100.html Two-comportment silicone elastomer enables a new technology to protect mission-critical electronic components from damage due to heat, shock and vibration. Fri, 04 May 2007 08:00:00 UT Lord Corporation http://www.electronicstalk.com/news/lod/lod101.html