Product category:
Gaskets, Seals and Screens
News Release from: MTI Leewood | Subject: MagniCell TI
Edited by the Electronicstalk Editorial
Team on 25 October 2006
Silicone sponge closes the gap on
heatsinks
Thermally conductive silicone sponge helps remove heat generated by electronic devices.
MagniCell TI from MTI Leewood is a thermally conductive grade of silicone sponge designed to remove the heat generated by an electronic device, away from sensitive components to ensure a safe reliable operating environment Warm air trapped between a heat generating component and a heatsink means ineffective heat transfer from hot area to the exterior of a closed system
MagniCell compressible thermal interface materials provide a thermal path between the components, therefore ensuring heat build up is no barrier to repeat performance.
Magnicell TI material is available in medium and firm compressibility grades: both are certified to UL94V1 and are RoHS compliant.
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