Product category:
Microprocessors, Microcontrollers and DSPs
News Release from: LSI Europe | Subject: RC11Si250 slice
Edited by the Electronicstalk Editorial
Team on 30 April 2004
Slice brings more gates and memory to
the platform
LSI Logic continues to expand its RapidChip Integrator platform ASIC family with the release of the RC11Si250 slice, claimed to offer the highest logic and memory content of any 0.11um platform ASIC.
LSI Logic continues to expand its RapidChip Integrator platform ASIC family with the release of the RC11Si250 slice, claimed to offer the highest logic and memory content of any 0.11um platform ASIC The RC11Si250 RapidChip Integrator slice combines 10.5M available gates with 5.68Mbit of diffused memory, which is expandable to more than 6Mbit when combined with transistor fabric based memories
This article was originally published on Electronicstalk on 23 May 2001 at 8.00am (UK)
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All LSI Logic RapidChip platform ASICs use a transistor fabric architecture that delivers the optimum balance of performance and density.
Included in the RC11Si250 slice, as well as all other RapidChip Integrator slices, is a feature known as the "Landing Zone" region.
In this area, logic and memory resources are arranged so that a user can efficiently implement either an ARM926 microprocessor core running at 200MHz or MIPS4Kec at 167MHz.
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If an application does not use a processor on chip, the Landing Zone logic and memory elements are not wasted and may be used to implement user logic.
The Landing Zone region on the RapidChip Integrator slices further speeds time-to-market for designers when combined with LSI Logic's System CoreWare as together they deliver predesigned, pretimed and preverified processor designs.
"With its system integration capabilities and flexible Landing Zone feature for processor implementation, RC11Si250 pushes the standards in platform ASICs to new heights", said Yousef Khalilollahi, RapidChip Marketing Director, LSI Logic.
The RapidChip Integrator family also has additional flexibility in memory interface design with the ability to implement DDR on demand at up to 400Mbit/s point to point.
With slice-to-slice migration available in compatible package footprints, the RapidChip Integrator family offers comprehensive support for low-risk design/feature creeps.
The RC11Si250 is available in 896 or 1152 flip-chip BGA packages and is available immediately for customer designs.
RapidChip platform ASICs combine the high-density, high-performance benefits of cell-based ASICs with the fast time-to-market and customisation benefits of FPGAs, and the proven IP benefits of ASSPs.
Target markets include communications, consumer, storage, industrial, medical and defence.
The RapidChip platform uses LSI Logic's high-performance field-tested CoreWare IP, customisable logic, embedded memory, and innovative design concepts to significantly reduce design and manufacturing risk and costs.
The RapidChip platform also provides a fast and seamless migration path to full standard-cell ASIC - driving unit costs even lower.
Unique to the RapidChip concept is the customer-friendly RapidWorx interface, which dramatically simplifies the underlying complexity of the design tools and flows associated with SoC design.
Rule sets automatically manage architectural design, verification, and physical design.
As a result, design schedules for high-performance chips are very predictable.
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