Product category:
Intellectual Property Cores
News Release from: LSI Europe | Subject: RapidChip IntegratorQS slices
Edited by the Electronicstalk Editorial
Team on 09 September 2004
Slices advance high-speed serial
interconnect
Affordable high-speed interconnect solutions (x1 through x4) are now available to PCI Express developers with three new RapidChip IntegratorQS slices.
Affordable high-speed interconnect solutions (x1 through x4) are now available to PCI Express developers with three new RapidChip IntegratorQS slices The new slices leverage LSI Logic's proven-in-silicon and standards-compliant GigaBlaze serdes technology by including four independent lanes of 4.25Gbit/s serdes
This article was originally published on Electronicstalk on 23 May 2001 at 8.00am (UK)
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Another key architectural advantage of the RapidChip IntegratorQS slices is that they support PCI Express datapaths of 250MHz.
These datapaths are implemented in the metal configurable R-cell logic transistor fabric.
The combination of serdes and logic performance ensures that developers can implement ASIC-class low latency, high system performance solutions, with the benefits of risk mitigation and affordable NRE costs associated with platform ASIC technology.
Further reading
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LSI Logic has announced the immediate availability of the LiquidLogic core, an embedded programmable logic technology that can be used in both ASIC and ASSP SoC designs.
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LSI Logic has added a range of single, dual and quad 2Gbit/s PCI-X Fibre Channel host adapters to its already successful line of PCI Fibre Channel products.
The RapidChip IntegratorQS platform ASIC family provides faster time to market and a low-risk path for product developers who want to implement value added PCI Express peripherals and bridges in the communications, networking, computing and storage markets.
The IntegratorQS slices range from 1 to 2.9 million usable gates, allowing developers to choose an optimal solution for their particular application.
"With momentum building behind serial interconnect standards and mainstream adoption of PCI Express, we believe the RapidChip IntegratorQS family of slices is ideally suited for applications in the 1x through 4x category", commented Arnaud Schleich, Vice President of Sales and Marketing at PLDA, a leading IP developer focused on the needs of the PCI developer community.
"At PLDA, we recognise the potential of technologies like LSI Logic's RapidChip platform ASIC".
"By successfully porting our PCI-AHB and PCI-X cores to RapidChip, PLDA is enabling designers of RapidChip slices to take advantage of some of the industry's most popular PCI IP".
"By offering ASIC-class integration of our GigaBlaze technology into the new preverified RapidChip IntegratorQS slices, our customers benefit from the industry's leading integrated serdes, resulting in shorter time-to-market", said Mike Casey, Director, RapidChip Strategic Marketing, LSI Logic.
"Our five generations of integrated serdes technology is proven in volume production and is compliant to multiple standards, including PCI Express, Gigabit Ethernet, 10 Gigabit Ethernet, Fibre Channel, SAS, SATA and InfiniBand, with narrower datapaths and lower latency than is available on other solutions".
The IntegratorQS family continues to deliver features designers have come to expect from LSI Logic's RapidChip technology: slice to slice migration in compatible footprint packages for comprehensive support of low-risk design or feature creeps; IP on-demand, including Landing Zone support for ARM926EJ-S at up to 200MHz and configurable DDR interfacing at up to 200MHz point-to-point.
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