TTPCom to design ARM-based platform ASIC

Edited by the Electronicstalk editorial team Sep 15, 2005

TTPCom has selected the LSI Logic RapidChip Integrator2 platform ASIC for its next generation 3G cellular modem technology - the Cellular Baseband Macro 3G.

TTPCom has selected the LSI Logic RapidChip Integrator2 platform ASIC for its next generation 3G cellular modem technology - the Cellular Baseband Macro 3G.

The CBEmacro 3G will be the world's first complete IP and software platform for multimode 3G baseband designs which will be delivered to customers in an easily integrated "black box" format.

The first test chips are expected in Q1 2006.

With up to 5 million available gates and 8.3Mbit of RAM, LSI Logic's largest RapidChip Integrator2 slice, the RC11Si390, will address TTPCom's need for fast time to market, very high integration and high-speed performance.

TTPCom will be embedding the high-performance ARM1156T2-S processor and will use the ARM1156T2-S processor reference design to further accelerate the production process.

"Reducing turnaround time was a crucial consideration for us in making the decision to use LSI Logic's RapidChip platform ASIC solution", said Julian Hildersley, Managing Director of TTPCom's Silicon Business Unit.

"A silicon implementation is key to our philosophy of validating our modem designs and LSI Logic's RapidChip solution offers us a unique time-to-market advantage for our CBEmacro technology".

Mike Casey, Director of Strategic marketing, LSI Logic Europe said: "The technology involved in a multimode modem is highly complex".

"Consequently TTPCom's CBEmacro 3G presented a great opportunity to demonstrate the capabilities of the RapidChip Integrator2 slice architecture, such as flexible, diffused memory configurations with MatrixRAM memory".

"The CBEmacro 3G technology takes full advantage of the comprehensive resources offered by the RapidChip Integrator2 family".

"The integration of ARM processor IP and TTPCom's cellular modem IP, and its proof on the LSI Logic RapidChip platform ASIC will provide 3G cellular handset manufacturers with a true competitive advantage", said Warren East, CEO, ARM.

"Manufacturers need to focus on adding new and highly differentiated functionality in the shortest possible timescales, and this collaboration will help them do just that".