Latest news on Electronicstalk categorised by supplier
Master Bond
Please note: More news from Master Bond on the Manufacturingtalk web site
Address:
154 Hobart Street
Hackensack
NJ 07601
USA
Telephone: (USA) +1 201-343-8983
http://www.masterbond.com
Our RSS feed for news from Master Bond
Request to receive our free email newsletter each week
Listing of all 16 news releases from Master Bond:
Easy-curing compound lets RF pass through
Cured polymer compound fully meets the requirements for radio opacity needed in medical devices and similar applications.
News from Master Bond (15 May 2008)
Potting compound covers complex contours
MasterSil 151 has superior electrical insulation properties, high tensile strength and superb optical clarity.
News from Master Bond (12 March 2008)
Polymer potting agent is easy to work
Can be cured in much greater section thickness than most conventional UV type systems, making it ideal for potting and encapsulation applications.
News from Master Bond (11 March 2008)
Conductive epoxy holds on tight
Silver-filled epoxy-resin system is suited for making electrically conductive connections in sensitive electronic components that are expected to withstand severe service conditions.
News from Master Bond (15 February 2008)
Thermally conducting resin bonds, coats and pots
Master Bond has completed in-use trial testing of EP21TDC-2AN, a highly flexible, two component, thermally conducting epoxy resin compound for high performance bonding, coating and encapsulation.
News from Master Bond (27 December 2006)
Silver preforms stick to conducting
A new silver conductive epoxy film and preform system cures very quickly at moderately elevated temperatures and features very high electrical conductivity.
News from Master Bond (13 January 2006)
Conductive preforms promise high bond strength
A new silver conductive epoxy film and preform system features remarkably high resistance to vibration and shock as well as thermal cycling.
News from Master Bond (26 December 2005)
Potting compound boasts superior toughness
A new two-component epoxy-urethane compound called EP30DP is ideal for bonding, sealing and potting applications.
News from Master Bond (25 August 2005)
Electrically isolating epoxy is easy to use
A new two component, thermally conductive, electrically isolating epoxy adhesive has a forgiving 1 to 1 mix ratio by weight or volume.
News from Master Bond (28 June 2005)
High thermal stability for potting compound
A new two-component epoxy system boasts high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability.
News from Master Bond (16 February 2005)
Epoxy system boasts minimal smoke generation
A new nonhalogenated epoxy resin system offers outstanding flame resistance and minimal smoke generation, even on prolonged exposure to open flames.
News from Master Bond (13 January 2005)
Epoxy compound handles hot duties
A new low-viscosity thermally conductive, electrically insolative two-component epoxy compound is ideal for potting, casting, encapsulation and sealing for service temperatures up to 260C.
News from Master Bond (16 December 2004)
Epoxy adhesive aids thermal management
A new two-component room-temperature-curing epoxy adhesive features a particularly high thermal conductivity.
News from Master Bond ( 3 December 2004)
Electrically conductive silicone bonds and seals
A new two-component graphite-filled electrically conductive silicone compound promises high-performance bonding and sealing.
News from Master Bond (16 November 2004)
Epoxy offers chemical resistance
Master Bond has developed a new two component epoxy system for service above 260C, designed to withstand exposure to boiling acids, alkalis, salts, fuels and most organic solvents.
News from Master Bond (15 November 2004)
New flexible, low viscosity potting compound
A new easy-to-use, low viscosity epoxy potting and encapsulation compound called EP30FL has been introduced by Master Bond.
News from Master Bond ( 3 November 2004)
