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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Master Bond | Subject: EP121AO
Edited by the Electronicstalk Editorial Team on 16 December 2004

Epoxy compound handles hot duties

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A new low-viscosity thermally conductive, electrically insolative two-component epoxy compound is ideal for potting, casting, encapsulation and sealing for service temperatures up to 260C.

Master Bond, has formulated EP121AO, a new low-viscosity thermally conductive, electrically insolative two-component epoxy compound for potting, casting, encapsulation and sealing for service temperatures up to 260C The Master Bond EP121AO epoxy resin compound is comprised of a specially developed heat resistant liquid epoxy resin and a unique curing agent which exhibits unexcelled thermal stability

The mixed Master Bond EP121AO system exhibits a long pot (working) life at ambient temperatures and is readily cured at temperatures ranging from 135 to 200C.

After cure it has a thermal conductivity of 1.44W/(m2K/m), as well as excellent mechanical strength properties, superior electrical insulation characteristics and outstanding thermal stability.

Master Bond EP121AO features remarkable long term heat resistant properties at temperatures in the 200-230C range and can be readily subjected to repeated temperature excursions as high as 260C.

Its shrinkage is negligible and it has superb dimensional stability.

EP121AO has excellent flowability and low exotherm during cure and can therefore be safely employed for casting, potting, and encapsulation, in either thick or thin sectioned shapes.

EP121AO is being widely accepted in the electrical/electronic and related industries wherever a high degree of heat dissipation from active power components etc is desirable.

Master Bond EP121AO has also been used in high temperature insulation applications where mechanical strength properties must be retained at and above 230-260C.

It is available in pints, quarts, gallons, 5-gallon pails and drums.

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