Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Master Bond | Subject: EP21TDC-2AN
Edited by the Electronicstalk Editorial
Team on 27 December 2006
Thermally conducting resin bonds, coats
and pots
Master Bond has completed in-use trial testing of EP21TDC-2AN, a highly flexible, two component, thermally conducting epoxy resin compound for high performance bonding, coating and encapsulation.
Master Bond has completed in-use trial testing of EP21TDC-2AN, a highly flexible, two component, thermally conducting epoxy resin compound for high performance bonding, coating and encapsulation The cured compound exhibits a high, 31% elongation, truly exceptional for a thermal conductive epoxy where the conductivity is a robust 2.6W/m-K
This article was originally published on Electronicstalk on 3 Nov 2004 at 8.00am (UK)
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New flexible, low viscosity potting compound
A new easy-to-use, low viscosity epoxy potting and encapsulation compound called EP30FL has been introduced by Master Bond.
Epoxy offers chemical resistance
Master Bond has developed a new two component epoxy system for service above 260C, designed to withstand exposure to boiling acids, alkalis, salts, fuels and most organic solvents.
As very little exotherm is developed during cure, EP21TDC-2AN is suitable for potting and encapsulation in very thick as well as thin sectioned configurations.
This versatile epoxy resin compound exhibits superior tensile shear of over 7.4MPa together with excellent peel strength greater than 2.6N/mm.
Trial results show it being successfully employed in a number of demanding aerospace and chemical industry applications.
In these trials it has shown improved long term performance over various other flexible compounds such as polysulphide compositions over a wide service temperature range starting from -185C and going up to +120C.
As such, EP21TDC-2AN is also recommended for cryogenic applications.
Due to its excellent flexibility, it is superb for bonding substrates with greatly differing coefficients of expansion.
Master Bond EP21TDC-2AN produces durable high quality bonds to many different substrates including metals, glass, ceramics, wood, vulcanised rubber and many plastics.
The hardened composition is a good electrical insulator with a volume resistivity of greater than 1Tohm-cm.
In addition to high elongation and peel strength it has excellent thermal shock and chemical resistance including exposure to erosion from water, gasoline and numerous acids, bases and salts.
EP21TDC-2AN can also be widely used in electronics, electrical, computer, metalworking, appliance, automobile and chemical industries.
It is available in premixed bi-packs and cartridge/gun packaging for convenient dispensing as well as in pint, quart, gallon and 5 gallon container kits.
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