Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Master Bond | Subject: EP11SIC
Edited by the Electronicstalk Editorial
Team on 15 February 2008
Conductive epoxy holds on tight
Silver-filled epoxy-resin system is suited for making electrically conductive connections in sensitive electronic components that are expected to withstand severe service conditions.
Master Bond EP11SIC is a cost effective, silver-filled epoxy-resin system featuring exceptionally high electrical and thermal conductivity It offers the application convenience of a single-component system in addition to flexible cure schedules so as to best meet specific processing requirements
This article was originally published on Electronicstalk on 3 Nov 2004 at 8.00am (UK)
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Epoxy offers chemical resistance
Master Bond has developed a new two component epoxy system for service above 260C, designed to withstand exposure to boiling acids, alkalis, salts, fuels and most organic solvents.
It has superior adhesion to both metallic and nonmetallic substrates with a tensile strength greater than 40MPa and a tensile shear strength over 10MPa.
EP11SIC is amazingly tough for a filled system and features good resistance to thermal shock, high temperatures and chemicals.
It is recommended for bonding, potting, sealing and coating over the wide temperature range of -50 to over +150C.
Master Bond Polymer System EP11SIC is supplied in the form of a silver-coloured flowable paste.
The gel time at 150C is in the order of 20-25 minutes, and cure is of the order of 40-50 minutes at 175C.
Typical performance properties include a very low volume resistivity less than 0.001ohm-cm, a surface resistance of less than 1ohm/square and a very robust thermal conductivity of 7.9W/m-K.
Master Bond Polymer System EP11SIC is particularly well suited for making electrically conductive connections in sensitive electronic/electrical components which are expected to withstand severe service conditions.
Its physical strength and toughness permit it to adjust to both mechanical and thermal stresses without damaging such components.
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