Product category:
IC and Hybrid Processing Equipment
News Release from: Micralyne
Edited by the Electronicstalk Editorial
Team on 07 July 2006
Investment expands MEMS packaging
capabilities
Micralyne has purchased the SB6e wafer bonder and BA6 aligner system from SUSS MicroTec, a leading supplier of precision manufacturing and test equipment for the semiconductor and emerging markets.
MEMS specialist Micralyne has purchased the SB6e wafer bonder and BA6 aligner system from Suss MicroTec, a leading supplier of precision manufacturing and test equipment for the semiconductor and emerging markets Due to increasing production demands over the past year, Micralyne has doubled its employee base and added additional working shifts at its 4400m2 plant
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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As part of this ramp up to volume production Micralyne is investing in facility expansion and capital equipment, such as adding aligned wafer bonding capacity.
"The growth in our foundry business makes capital equipment purchases more critical than ever".
"After careful evaluation of equipment suppliers, we chose Suss for our production wafer bonding needs".
"SUSS has the refined equipment tool set and technical support infrastructure needed by MEMS chip manufacturers today", said Chris Lumb, President and CEO of Micralyne.
"We are seeing strong chip demand in several markets including life sciences, optical networking, and a variety of sensor applications".
"Micralyne is clearly a leader in MEMS development and manufacturing".
"The MEMS foundry business is an increasingly growing market segment for Suss as more and more companies go fabless, and we are delighted to have been selected by them for their wafer bonding production needs", said Michael Kipp, President, Wafer Bonder Division, Suss MicroTec.
The SB6e is a semi-automatic computer-controlled stand-alone substrate bonder.
Featuring a rigid vacuum/pressure chamber, upper and lower independent heaters and wafer stack loading arm, the SB6e represents the latest generation of Suss substrate bonders.
Combined with the BA6 Suss bond aligner the SB6e provides superior post bond alignment, force and temperature uniformity, and pressure control capabilities for wafer level packaging of MEMS.
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