Product category:
Electronics Manufacturing Services
News Release from: MCE Newmarket
Edited by the Electronicstalk Editorial
Team on 30 May 2007
Study vindicates chip-on-board
reliability
Extensive programme of reliability tests validates performance of chip-on-board (COB) technology for harsh environment applications.
MCE Newmarket has completed an extensive programme of reliability tests to validate the performance of chip-on-board (COB) technology for harsh environment applications COB technology involves mounting bare semiconductor chips directly onto the printed circuit board
This article was originally published on Electronicstalk on 31 Jan 2001 at 8.00am (UK)
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The chip and its wire bonded leads are then encapsulated in an appropriate medium such as an epoxy or silicone adhesive - so called "glob topping".
One of the main concerns about the implementation of COB technology is the reliability of glob-topped components in harsh environments.
MCE Newmarket has developed new criteria for the evaluation of COB assemblies based on the BS9450 scheme for the certification of electronic components.
A comprehensive test programme has been undertaken on test circuits fabricated on high temperature FR4 and flexirigid printed circuit boards and ceramic substrates using both Pb-free and Pb-based solders and selected glob-top encapsulants.
The tests performed included high temperature storage, operation under rapid change of temperature and "damp heat" testing for representative industrial, telecomms and aerospace/defence environmental performance specifications.
The materials and assembly processes tested have passed all of the environmental tests for durations of at least 1000 hours.
The data provide the assurance that COB technology can be applied in demanding applications, with specific advantages in space restricted systems.
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