Product category:
Electronics Manufacturing Quality Assurance
News Release from: Metryx | Subject: Mentor OC23
Edited by the Electronicstalk Editorial
Team on 26 July 2005
Metrology tool checks wafer processing
steps
A high-throughput, simple-to-use, nondestructive metrology tool that offers atomic layer measurement accuracy has been developed by Metryx of Bristol, UK.
A high-throughput, simple-to-use, nondestructive metrology tool that offers atomic layer measurement accuracy has been developed by Metryx of Bristol, UK The Metryx Mentor OC23 tool is designed to measure material characterisation properties and quickly determine whether device manufacture process steps are operating correctly
This article was originally published on Electronicstalk on 11 Jan 2006 at 8.00am (UK)
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Wafer metrology tool offers atomic layer accuracy
A new nondestructive nanotechnology weight metrology tool handles high-volume production of 300mm semiconductor wafers.
Weight metrology tool keeps wafers honest
A novel nanotechnology weight metrology tool offers atomic layer measurement accuracy and is designed to handle the demands of volume production environments.
The unique Metryx technology allows process changes to be reliably and accurately determined after deposition, wet or dry etch or CMP processing.
Based on innovative nanotechnology weight measurement, the Metryx Mentor OC23 tool heralds a new generation in metrology.
Using nondestructive measurement on production wafers, the small footprint Metryx Mentor OC23 can directly assess if a process has been carried out successfully from statistical process control (SPC) methodology.
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Capable of throughputs of 75 wafers per hour, nanotechnology weight measurement can be used on product, test and blanket wafers independent of substrate size or material.
Offering fully automatic cassette-cassette operation the Metryx Mentor OC23 uses industry standard 200 and 300mm open cassettes to allow measurements of the wafers before and after processing.
Control of ambient conditions within the measurement enclosure is fully automatic providing a weighing capability of better than 0.04mg which equates to approximately 0.7nm or roughly two atomic layers.
The system is controlled via an SVGA touchscreen with simple-to-use software.
Advanced automation software enables the tool to be fully integrated into any fab host communications network.
The system is capable of offering SPC of individual process steps as well as of the general manufacturing process.
The Metryx Mentor OC23 system combines accurate force measurement and advanced compensation software algorithms to improve weighing accuracy compared with previous techniques.
Almost any IC manufacturing process that results in a change in mass will benefit from this reliable tool, which has been achieving more than 95% uptime in advanced production environments.
"The Metryx Mentor OC23 can deal with many critical applications that other metrology systems cannot handle".
"The tool is sensitive enough to distinguish very subtle differences in process performance on product wafers and hence subsequent identification of manufacturing issues".
"This provides huge cost savings and increased profitability for our production customers", explained Dr Adrian Kiermasz, Vice President, Business Development of Metryx.
The Metryx Mentor OC23 is the first in a series of nanotechnology weight metrology products specifically designed for monitoring critical IC process steps in a variety of device applications, including memory and logic components.
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