Roadshow demonstrates inspection and rework

A Metcal product story

Edited by the Electronicstalk editorial team Mar 26, 2002

Metcal is hitting the road with a series of presentations around Europe, starting in April in Wales.

The successful rework of expensive assemblies is often critical to profitability.

Companies are facing ever greater challenges when reworking components that are becoming increasingly miniaturised.

Metcal has addressed these challenges with the very latest technology in array package rework and optical inspection.

At various venues throughout Europe, Metcal is holding demonstrations of its brand new APR-5000 array package rework system, an advanced, versatile system offering the repeatability, accuracy and thermal control essential for the safe and effective rework of today's leading-edge BGA, CSP, land grid array (LGA), micro SMD, micro-lead frame (MLF) and bumped chip component packages.

Also on show will be the new VPI-1000 optical inspection system, offering an economical inspection solution that gets tighter, closer and lower than any other optical system, for the inspection of BGAs, CSPs, LGAs etc.