Product category:
PCB Assembly Equipment and Tools
News Release from: Metcal | Subject: APR-5000-XLS
Edited by the Electronicstalk Editorial
Team on 15 July 2003
Rework system expands to handle bigger
boards
The APR-5000-XLS array package rework system uses a single reflow/placement head and a stationery PCB centred over an enhanced, dual-zone pre-heater capable of handling both large and small boards.
When it was unveiled in 2001, Metcal's APR-5000 array package rework system established a new standard in repeatability, accuracy and thermal control Now Metcal has developed the APR-5000-XLS array package rework system for large-to-small printed circuit boards; again setting the benchmark for the precise, cost-effective rework of the widest range of component types, including today's leading-edge BGA, CSP, land grid array (LGA), micro SMD, micro-lead frame (MLF) and bumped chip component packages
This article was originally published on Electronicstalk on 17 Oct 2001 at 8.00am (UK)
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The APR-5000-XLS is capable of handling boards 610 x 610mm in size and up to 6.35mm thick.
Using the same revolutionary design technology as the APR-5000 array package rework system, the APR-5000-XLS uses a single reflow/placement head and a stationery PCB that is centred over an enhanced, dual-zone pre-heater capable of handling both large and small boards.
Key to the system's flexibility and process repeatability is Metcal's powerful, accurate heating, which offers full convection in both the reflow heater and dual-zone pre-heaters.
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Rework system focuses on array packages
The APR-5000 array package rework system is a versatile system offering the repeatability, accuracy and thermal control essential for safe and effective rework of today's leading-edge packages.
The result is uniform temperature control not only horizontally, across the surface of large and small PCBs, but also vertically, over stacked components.
With the use of five thermocouple inputs and closed-loop RTD temperature control, the APR-5000-XLS allows for meticulous temperature control across a rework area up to 6.35mm thick.
Closed-loop, computer-controlled parameters of time, temperature and airflow guarantee process repeatability and precision, even at the higher temperatures demanded by lead-free soldering.
Able to remove and replace components down to 0.51 x 0.25mm, the APR-5000-XLS employs motorised control of x, y, z and theta axis for extreme adjustability.
The motorised theta axis provides 360-degree rotation to simplify component orientation.
Together, these controls reduce operator fatigue, improve placement accuracy and offer the industry's highest level of process consistency.
New to the APR-5000-XLS is Metcal's innovative split vision system, which allows operators to view the opposite corners of a component with the necessary magnification to make its placement and registration fast and accurate.
This is an essential feature when reworking larger fine-pitch components.
As the industry pursues lead-free technologies, the Metcal single head design helps achieve a consistent, tight delta T across the board and the component.
Metcal's insight means that the system's reflow heater and pre-heater are perfectly suited for the higher temperatures required by lead-free assemblies.
Thermal damage is avoided due to the system's precisely controlled pre-heater; sophisticated lead-free profiles can be quickly developed via the system's five thermocouples; and the closed-loop controls provide operators with the process control that is essential when reworking lead-free devices.
Due to the thermal sensitivity of array packages, the ability to ramp temperatures at a rate that will not harm them is crucial.
Consequently, the APR-5000-XLS employs four heating zones and one cooling zone.
In addition, the system's controlled pre-heater helps to avoid the risk of thermal damage associated with exposing heat-sensitive components, unsuitable for heating above 240C, with quick reflow times.
Setup of the APR-5000-XLS is fast.
Process calibration is easy and remains consistent from operator to operator, machine to machine.
Metcal software is both instructive and intuitive, walking the engineer through the steps of process development and then instructing the operator to ensure consistent execution of the automatic profile functions.
Process and profile files can be saved and password-protected, making them transferable to similar systems globally in order to achieve process and operation repeatability and control.
"The release of the APR-5000-XLS array package rework system is a watermark for our range of repair and rework systems", explained Howard Rupprecht, Metcal's VP of Marketing.
"The new system is the logical result of our experience with array package rework, coupled with fundamental changes in electronics manufacturing.
As lead-free intensifies and product design changes, the APR-5000-XLS has the power, size and sophistication to meet higher, cost-sensitive performance criteria, while delivering the process repeatability and ease of use today's leaner industry demands".
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