EEPROM suits high reliability applications
A
Mintech Interconnect and Test product story
Edited by the Electronicstalk editorial team
Dec 14, 2005
A ceramic 128K x 32bit surface mount EEPROM module is designed for use in high reliability applications.
Mintech's Interconnect and Test Division has introduced a ceramic 128K x 32bit surface mount EEPROM module for use in high reliability applications.
The industry standard M128E32G part is available in a JEDEC footprint 68-lead ceramic quad flatpack (CQFP) package and is available with access times of 130, 150 and 200ns.
The device may be configured as 8, 16 or 32bit wide.
The two cavity, MCM approach gives a high density solution in a surface mount ceramic package that has overall dimensions 25.15 x 25.25 x 5.44mm.
The gullwing leadframe is designed to relieve the stress generated by the differences in thermal expansion between the ceramic package and the system board.
The device can be supplied as commercial and industrial grade but is best suited to harsh environments such as civil and military avionics, where it is offered screened in accordance with BS9400 or MIL-STD-883.
The M128E32G is in full production at Mintech's Norwich factory.
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