Seminar addresses chip-on-board techniques

The very first "National Semiconductor chip on board seminar" to be held in the UK will take place on Thursday 26th September 2002 at the Hilton Norwich.

The very first "National Semiconductor chip on board seminar" to be held in the UK will take place on Thursday 26th September 2002 at the Hilton Norwich.

Hosted by Mintech Semiconductors and Die Technology - National Semiconductor's die distributors for Europe - the seminar is free for all potential delegates who preregister on the Mintech website before Friday 20th September 2002.

Component integration and the miniaturisation of electronic assemblies enable manufacturers to create smaller, lighter and higher performance products.

Die solutions, whether implemented as chip-on-board (COB) or flip chip, when combined with high-density substrates provide significant performance and integration advantages.

From design to manufacture, understanding the benefits and trade-offs of utilising unpackaged semiconductor die will assist in creating maximised system solutions.

The National Semiconductor 3-hour seminar focuses on the use of semiconductor die, the materials and processes directly associated with the manufacture of multidie assemblies, and specific applications.

The presenters address the current trends dictating the use of unpackaged semiconductor die; specifications of die products, die processing, key materials, implementation of die, and critical assembly issues.

Specific applications utilising die for integration improvements will be presented.

Particular attention will also be given to die preparation, COB processing and die assembly manufacturing pitfalls.

During the seminar references will be made to standard industry practices without detailed background explanations of basic principles.

The seminar will be of particular benefit to engineers and engineering managers.

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