Product category:
IC and Hybrid Processing Equipment
News Release from: Zarlink Semiconductor
Edited by the Electronicstalk Editorial
Team on 13 April 2007
Project aims for flexible packaging
technology
Zarlink has joined a European Commission funded project to develop flexible, highly integrated packages for emerging electronic systems.
Zarlink Semiconductor has joined the SHIFT Project (Smart High-Integration Flex Technologies) Cofunded by the European Commission, the project is developing flexible, highly integrated packages for emerging electronic systems, including medical devices, portable communication tools, smart cards and aerospace applications
This article was originally published on Electronicstalk on 7 Feb 2001 at 8.00am (UK)
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The SHIFT Project consortium consists of R and D institutes, industrial flex manufacturers, end-users and a technology support agency.
Zarlink's participation in the SHIFT Project is based in its Caldicot, UK site.
The company's work will be initially focused on developing flexible packaging technology for the personal medical device market.
The first SHIFT enabled product demonstrator from Zarlink will be available in the summer of 2007.
With the increase in electronics systems that are located near, on or even implanted in patients, product manufacturers are seeking lightweight, flexible and compact designs to increase product functionality, user comfort and convenience.
The embedding of components in flexible materials such as polyimides will be used as the basis of these products.
To boost the combination of high functionality and compactness as well as user comfort, there is a need for substantial development in the use of embedded components in flex substrates.
"Medical electronic systems that move along with the user increasingly require more functionality, and must be extremely small, lightweight and available at a reasonable price", said David Hatherall, External Project Leader at Zarlink's Caldicot facility.
"This trend is just starting and it's clear that we need to advance 'smart' packaging technology, which means developing a flexible multilayer structure supporting multiple functions".
Zarlink's Caldicot facility is a leader in advanced micropackaging solutions for medical, high reliability and security markets.
It offers unique solutions that give customers the flexibility to incorporate a higher component count and greater functionality in a smaller space than what is typically found in conventional electronic assemblies.
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