Product category:
Communications ICs (Wireless)
News Release from: Zarlink Semiconductor | Subject: ZL70101
Edited by the Electronicstalk Editorial
Team on 03 May 2007
Implantable transceiver makes medical
link
Ultra-low-power RF transceiver SoC is designed for use in implanted medical devices, programmers and monitoring basestations.
New from Zarlink Semiconductor, the ZL70101 is an ultra-low-power RF transceiver SoC for use in implanted medical devices, programmers and monitoring basestations Building on Zarlink's MICS technology platform, the ZL70101 transceiver chip delivers high datarates, low power consumption and unique wake-up circuitry
This article was originally published on Electronicstalk on 21 Sep 2007 at 8.00am (UK)
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Using Zarlink's MICS technology, medical device manufacturers can design in-body communication systems that will improve patient care, lower healthcare costs, and support new monitoring, diagnostic and therapeutic applications.
Previous home health-monitoring systems required the patient to accurately position an inductive wand over the implanted device.
In comparison, using Zarlink MICS technology, patient health and implanted device performance data can be stored in the implanted medical device's memory and wirelessly transmitted to a basestation, without requiring patient intervention.
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Data can then be forwarded over the telephone or Internet to a physician's office.
If a problem is detected, the physician will schedule a patient follow-up visit where the two-way RF link can be used to interrogate and adjust implanted device performance.
During surgery to implant medical devices, the longer operating range of the ZL70101 chip allows the basestation/programmer to be located outside the sterile environment.
This potentially shortens surgery times and reduces healthcare costs, as programming equipment does not have to be sterilised for use in the operating room.
Ultra-low-power RF technology is also enabling a range of new diagnostics and therapies, including implanted devices used to monitor and treat diabetes, neurostimulators that alleviate chronic pain or lessen the debilitating effects of Parkinson's disease and dystonia, and gastric stimulators that may offer a viable alternative in the treatment of obesity.
"As in-body communication systems evolve to support advanced diagnostics and therapies, it's critical that radio performance does not impact the battery life of an implanted medical device", said Steve Swift, Senior Vice President and General Manager, Ultra Low-Power Communications, Zarlink Semiconductor.
"The ZL70101 transceiver offers unparalleled datarates and ultra low-power consumption performance in a highly integrated package, backed by Zarlink's established expertise in meeting the unique quality requirements for devices intended for human implant".
To help conserve implanted medical device battery life, in-body communication systems transmit data on a scheduled or as-required basis.
The ZL70101 transceiver incorporates a unique "wake-up" receiver that allows the integrated circuit to operate in an extremely low current 250nA "sleep" mode.
Communication is then initiated using a specially coded wake-up signal from the basestation transmitter.
The implanted medical device can also wake up the ZL70101 radio on detection of an emergency medical event.
An emergency signal could then be sent to the basestation, which in turn could directly alert paramedics.
When in full operation the ZL70101 typically consumes 5mA of supply current.
By using the high datarate with heavy duty cycling, the average power consumed by the ZL70101 can be very small.
This conserves overall implanted medical device battery life.
The highly integrated ZL70101 system-on-chip includes a MAC that implements a communication protocol specifically designed for the requirements of high-reliability implanted medical devices and is fully compliant to current MICS standards.
The MAC protocol includes Reed-Solomon forward error correction together with CRC (cyclical redundancy check) error detection and retransmission to achieve an extremely reliable data link.
The chip requires just three external components, excluding antenna matching, allowing device manufacturers to use board space savings to increase battery sise and support advanced functionality while lowering overall system BoM (bill of material) cost.
The ZL70101 transceiver chip is available as implantable-grade wire-bondable die or in a 48-pin QFN (quad flat no-lead) package for the nonimplanted basestation applications.
The chip is fully supported by a reference system and application development kit.
Full ZL70101 product information, including complete data sheet, design manual and pricing, is available for qualified customers.
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