Guide to custom thin film circuits

The new "Micrometrics thin film design guide" is a handy engineering guide for ordering custom thin film circuits.

The new "Micrometrics thin film design guide" is a handy engineering guide for ordering custom thin film circuits.

Engineers looking for RF and microwave circuits, data converters, signal conditioners, amplifiers, networks, terminations and delay lines will find the guide useful in preparing an RFQ.

The guide discusses issues such as geometry and through holes, wraparounds, and backside contacts.

In addition, fine pitch conductors with up to 0.0005in line and space requirements are discussed as well as integrated resistors and double-sided patterning with or without vias.

Substrate material choices covered include alumina, beryllium, aluminium nitride, fused silica, ferrite, glass, titanates and silicon.

On the metallisation side standard TaN/TiW/Au is the material of choice; however other films reviewed include titanium, nickel and palladium.

Standard processes include pattern plated and/or wet chemical etch back conductors, etch back resistors, plated through holes, and choices of either laser or ultrasonic drilled vias.

MicroMetrics' custom metallisations are deposited using either sputtered or electroplated techniques on a wide variety of ceramics and dielectric materials.

An application engineering team is available to assist with choosing the proper substrates and metallisation schemes as well as consulting on handling.

MicroMetrics' quality procedures are certified to ISO9001 standards.

Although most existing military and aerospace requirements are met under these guidelines, MIL-STD-883 is the standard for 100% visual inspection during in-house procedures and MIL-STD-105D Level II sampling is the standard for final QA.

Back to top