Product category:
Analogue and Mixed Signal ICs
News Release from: Mimix Broadband | Subject: XD1002
Edited by the Electronicstalk Editorial
Team on 27 June 2005
Distributed amp keeps control of gain
A new gallium arsenide monolithic microwave integrated circuit distributed amplifier can be used as an ultrawideband amplifier or a fibre optic modulator driver.
Mimix Broadband has developed a new gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC) distributed amplifier that can be used as an ultrawideband amplifier or a fibre optic modulator driver Using 0.15 micron gate length GaAs pseudomorphic high electron mobility transistor (pHEMT) device model technology, this distributed amplifier covers the 0.05 to 50GHz frequency bands
This article was originally published on Electronicstalk on 5 Apr 2005 at 8.00am (UK)
Related stories
Buffer amp runs from 18 to 38GHz
A new gallium arsenide MMIC three stage buffer amplifier features ultrawide bandwidth and high dynamic range.
MMIC mixer is optimised as downconvertor
A new gallium arsenide monolithic microwave integrated circuit fundamental balanced mixer is optimised for use as a downconvertor.
The device has a small signal gain of 9dB with noise figure of 5dB across the band.
It also includes 15dB gain control and +9dBm output referred P1dB compression point.
This amplifier, identified as XD1002, is well suited for microwave, millimetre-wave, wideband military and fibre optic applications.
"The use of a distributed cascode topology allows well controlled gain while good match is obtained, and also maintains a relatively small variation in input referred third order intercept", stated Dr Jim Harvey, CTO of Mimix Broadband.
"The IIP3 for this device ranges from +5 to +11dBm as the gain is varied from below -5dB (minimum gain -5 to -8dB) to above +9dB (maximum gain +9 to +11dB)".
"Psat for this device is greater than +17dBm".
Mimix performs 100% on-wafer RF, DC and output power testing on the XD1002, as well as 100% visual inspection to MIL-STD-883 method 2010.
The chip also has surface passivation to protect and provide a rugged part with backside via holes and gold metallisation to allow either a conductive epoxy or eutectic solder die attach process.
Engineering samples are available today from stock, along with small production quantities.
• Mimix Broadband: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
