Amp suits microwave and millimetre-wave systems

The XD1001 is a gallium arsenide monolithic microwave integrated circuit distributed amplifier that can be used as an ultrawideband amplifier or a fibre optic modulator driver.

New from Mimix Broadband is a gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC) distributed amplifier that can be used as an ultrawideband amplifier or a fibre optic modulator driver.

Using 0.15 micron gate length GaAs pseudomorphic high electron mobility transistor (pHEMT) device model technology, this distributed amplifier covers the 18 to 50GHz frequency bands.

The device has a small signal gain of 17dB with noise figure of 5dB across the band.

It also includes 30dB gain control and +15dBm output referred P1dB compression point.

This amplifier, identified as XD1001, is well suited for microwave, millimetre-wave, wideband military and fibre optic applications.

"This device exhibits flat gain from 20 to 40GHz and is useful from 18 to 50GHz, with 14 to 15dB gain at 3V drain bias, and 17 to 19dB gain at 5V drain bias, with S11 better than -10dB, S22 better than -12dB, and maximum OIP3 in the 23 to 26dBm range, depending on frequency", stated Dr Jim Harvey, CTO of Mimix Broadband.

"In addition to the control of gain through drain bias voltage, the gain can be varied by adjusting the gate voltage from 0 to -0.8V, with input referred third order intercept point (IIP3) ranging from +10 to 0dBm as gain varies from 15 to 17dB (at Vg = -0.2V for best IP3) down to -5dB at Vg = -0.8V".

"The device is well suited to LO and RF buffering applications in broadband microwave radios, where a single part can be used for many applications".

"The part is also used as a subcircuit in many of Mimix's highly integrated receivers and up-convertors".

Mimix performs 100% on-wafer RF, DC and output power testing on the XD1001, as well as 100% visual inspection to MIL-STD-883 method 2010.

The chip also has surface passivation to protect and provide a rugged part with backside via holes and gold metallisation to allow either a conductive epoxy or eutectic solder die attach process.

Engineering samples are available today from stock, along with small production quantities.

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