Product category:
Communications ICs (Wireless)
News Release from: Mimix Broadband | Subject: 13/15GHz chipset
Edited by the Electronicstalk Editorial
Team on 14 October 2005
Chipset cuts transceivers down to three
devices
A new GaAs MMIC 13/15GHz chipset combines a highly integrated image reject receiver and transmitter with a compact two-stage power amplifier.
Mimix Broadband announced today the introduction of a gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC) 13/15GHz chipset that consists of a highly integrated image reject receiver and transmitter and a compact two-stage power amplifier The image reject mixers eliminate the need for an image bandpass filter after the amplifier to remove thermal noise at the image frequency
This article was originally published on Electronicstalk on 5 Apr 2005 at 8.00am (UK)
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The new three-chip solution lowers costs and variability of transceivers by using fewer parts, a smaller footprint area and a simpler design.
These devices are well suited for wireless communications applications such as millimetre-wave point-to-point radio, local multipoint distribution services (LMDS), satcom and Vsat applications.
"The receiver uses an image reject resistive 'cold FET' fundamental mixer to provide wide bandwidth and excellent intermodulation performance", stated Dr Jim Harvey, CTO of Mimix Broadband.
An image reject balanced mixer is used in the transmitter, or up-convertor, to minimise spurious and ease filtering requirements before the up-converted signal is fed to the compact single ended PA.
Linearity is suitable for the high order QAM modulation required in new radios to maximise spectrum usage.
The useful bandwidth of the receiver and transmitter is 10 to 18GHz, flat from 11 to 17GHz, so they cover the commercial 13 and 15GHz bands and intermediate satellite bands.
Mimix performs 100% on-wafer RF and DC testing on these products, as well as 100% visual inspection to MIL-STD-883 method 2010.
The chips also have surface passivation to protect and provide rugged parts with backside via holes and gold metallisation to allow either a conductive epoxy or eutectic solder die attach process.
Engineering samples are available today from stock.
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