Product category:
Analogue and Mixed Signal ICs
News Release from: Mimix Broadband | Subject: Three Stage Balanced GaAs MMIC
Edited by the Electronicstalk Editorial
Team on 31 July 2006
Three stage balanced GaAs MMIC power
amplifier
Mimix Broadband introduces three-stage balanced GaAs MMIC power amplifier and complementary driver amplifier at 43.5 to 46GHz.
Mimix Broadband has announced the introduction of a gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC) three stage balanced power amplifier and complementary three stage driver amplifier Both the balanced power amplifier and the driver amplifier use 0.15 micron gate length GaAs pseudomorphic high electron mobility transistor (pHEMT) device model technology
This article was originally published on Electronicstalk on 5 Apr 2005 at 8.00am (UK)
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The power amplifier has a balanced design to achieve good output match, covers the 43.5 to 46 GHz frequency bands, and has a small signal gain of 12 dB with +31 dBm P1dB compression point.
The driver amplifier covers this same frequency band and achieves a small signal gain of 14 dB with +24 dBm P1dB compression point.
Used as a driver and final stage cascade, this chip set achieves 26 dB gain and 2-watts saturated output power.
The balanced power amplifier and driver amplifier, identified as XP1015 and XP1016 respectively, are ideal for wireless communications applications such as millimetre-wave point-to-point radio, local multipoint distribution services (LMDS), and SATCOM applications.
"This chip set provides over 2-watts of saturated power at 44 GHz, and can be used with our integrated up-convertors to provide a complete transmitter chain," stated Dr Jim Harvey, CTO Emeritus of Mimix.
Mimix performs 100% on-wafer RF, DC and output power testing on the XP1015 and XP1016, as well as 100% visual inspection to MIL-STD-883 method 2010.
The chips also have surface passivation to protect and provide rugged parts with backside via holes and gold metallisation to allow either a conductive epoxy or eutectic solder die attach process.
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