Product category:
Communications ICs (Wireless)
News Release from: Mimix Broadband | Subject: GaAs MMIC receivers
Edited by the Electronicstalk Editorial
Team on 07 September 2006
Receivers come in surface-mount packages
Gallium arsenide monolithic microwave integrated circuit receivers in RoHS-compliant, surface mount technology packages cover 11 to 45GHz.
Mimix Broadband has a new family of gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC) receivers in RoHS-compliant, surface mount technology (SMT) packages, covering 11 to 45GHz Features of these parts include high linearity, low noise and broadband performance provided in low cost, standard QFN packages
This article was originally published on Electronicstalk on 5 Apr 2005 at 8.00am (UK)
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These receivers are ideal for wireless communications applications such as millimetre-wave point-to-point radio, local multipoint distribution services (LMDS), satcom and Vsat applications.
"To design an integrated receiver, ultimately you need world-class low noise amplifier and mixer performance characteristics", stated Damian McCann, CTO of Mimix Broadband.
"The Mimix integrated receivers, manufactured on state-of-the-art 0.15um GaAs pHEMT technology, offer both in a single device and also add LO buffer amplifiers for ease of application".
"By offering these highly integrated receivers in true surface mount packages, customers that typically use die-level products or a variety of individual packaged devices can now lower their material and assembly costs".
"In addition, they can improve their time to market by using these packaged receivers, which are 100% RF tested for specification compliance over a variety of environmental conditions".
"The packaged devices also allow our customers to simplify their application wiring and operational voltage bypassing, since this functionality is also included inside the package".
"These innovative products are just another way in which we are lowering the total cost of design for our customers".
Mimix performs 100% on-wafer RF, DC and noise figure testing on the receivers, as well as 100% visual inspection to MIL-STD-883 method 2010.
The chips also have surface passivation to protect and provide rugged parts with backside via holes and gold metallisation to allow either a conductive epoxy or eutectic solder die attach process.
Engineering samples are available today from stock, along with small production quantities.
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