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Product category: Intellectual Property Cores
News Release from: MIPS Technologies
Edited by the Electronicstalk Editorial Team on 24 January 2007

Cores to power the digital home

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NEC Electronics Corporation has selected the MIPS32 24KEc and 24KEf cores to power advanced solutions for the digital home.

NEC Electronics Corporation has selected the MIPS32 24KEc and 24KEf cores to power advanced solutions for the digital home MIPS Technologies holds a commanding presence in this burgeoning market segment, which includes digital TV, set-top boxes and DVD

For more than a decade, NEC Electronics Corporation has developed innovative solutions around both the MIPS32 and MIPS64 architectures.

Products include the 64bit VR Series, and single-chip offerings for a wide range of digital consumer products, such as personal video recorders and DVD recorders.

"As a proponent of the MIPS architecture and cores, we are pleased to broaden our successful relationship with MIPS Technologies", said Masao Hirasawa, General Manager, Digital AV Systems Division, NEC Electronics Corporation.

"Leveraging the superior cost advantages, low-power capabilities and performance of the 24KE cores allows us to design and deliver sophisticated and compelling next-generation solutions for the digital home".

"Over the years, our close collaboration with NEC has resulted in award-winning MIPS-Based designs in millions of digital consumer products worldwide", said John Bourgoin, President and Chief Executive Officer at MIPS Technologies.

"We're excited to expand our presence in the digital home market in Japan and living rooms around the globe".

The MIPS32 24KE core family leverages the high performance 24K microarchitecture while incorporating the MIPS DSP Application Specific Extension (ASE).

These instructions provide signal processing performance of up to 3x over a range of embedded applications compared with RISC implementations without the DSP ASE.

The 24KE family provides efficient DSP capability while significantly reducing overall SoC die area, cost and power consumption.

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