Product category:
Communications ICs (Wireless)
News Release from: Melexis | Subject: MLX80001
Edited by the Electronicstalk Editorial
Team on 20 August 2007
Four-channel LIN transceiver suits
automotive use
The MLX80001 can reduce system costs of the LIN physical layer by 20% compared to multiple single transceiver ICs found in, for example, a body control module.
To address the growing need for multi LIN transceiver systems in automotbiles Melexis has released a four-channel LIN transceiver IC The MLX80001 can reduce system costs of the LIN physical layer by 20% compared to multiple single transceiver ICs found in, for example, a body control module
This article was originally published on Electronicstalk on 17 Oct 2003 at 8.00am (UK)
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The MLX80001 extends Melexis' existing product line of LIN transceivers and system basis chips.
The LIN bus (local interconnect network) continues its successful adoption in automotive and industrial applications with the release of LIN version 2.0 and the release of SAE J2602 Networking specification.
This robust, cost-effective communication scheme enables many basic networking functions in sub-systems previously considered to be uneconomical for smart actuators and controls.
As a consequence of this successful implementation of many different LIN applications there is a need for body control modules to manage different LIN Bus sub-systems at the same time.
Thanks to our new MLX80001 this demand can be easily and cost-effectively implemented.
The MLX80001 combines four LIN transceivers on one die and enables the development of simpler and more cost-effective multi-LIN network master modules.
Integrated LIN master termination resistors and decoupling diodes further reduce system costs.
This four-channel LIN transceiver is produced in 0.8 micron HV-CMOS technology and is based on the industry proven single-channel transceiver TH8082.
The EMC behaviour of LIN Bus ICs is critical in automotive applications.
The MLX80001 design exhibits remarkable robustness when subjected to the injection of high-frequency disturbances.
The IC has also achieved very low electromagnetic emission to further simplify the design challenges of networked communication in hostile automotive environments.
For the data transmission according SAEJ2602 a special low slew mode is available.
The MLX80001 meets the automotive temperature range of -40C to 125C and has on chip protection against over-temperature, 40V load dump and LIN short to ground.
The integrated standby management allows the MLX80001 to "wake up" from the LIN bus itself or directly from a connected microcontroller or other external source.
Typical current consumption in sleep mode is as low as 20uA.
Final engineering samples are available and come in a space saving 20 pin QFN 5x5 RoHS compliant package.
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