Product category:
Heatsinks and Thermal Management
News Release from: Molex UK | Subject: Copper-core radial-fin heatsinks
Edited by the Electronicstalk Editorial
Team on 22 May 2001
Heatsinks generate 360-degree airflow
Molex is helping to offer maximum thermal performance and quieter PCs with its latest product - copper core radial fin heatsinks.
Molex is helping to offer maximum thermal performance and quieter PCs with its latest product - copper-core radial-fin heatsinks for applications with SECC2 and PGA microprocessors found in personal computers, workstations and servers Using Molex's patent pending radial folded fin design, these heatsinks generate a 360-degree airflow that results in higher volumetric efficiency and lower fan noise than traditional extruded heat sinks
This article was originally published on Electronicstalk on 26 Jan 2001 at 8.00am (UK)
Related stories
Save space with shrinking USB connectors
The new series of mini-BTM USB connectors from Molex take up only about 1/8th of the space of standard USB-B connectors.
All models feature a high fin count and hollow copper core that minimises weight without decreasing performance.
A spring clip helps to ensure easy mounting to standard microprocessor sockets, including Socket 462 and Socket 370.
To help meet challenging shock and vibration requirements, a dual tab clip is also available.
During full-system thermal testing, these heatsinks achieved as low as 0.5C/W, measuring case to ambient (includes thermal interface material).
Molex offers a variety of interface materials and fan choices.
• Molex UK: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
