Backplane speeds differential pairs

Engineers can achieve up to 5.0Gbit/s bandwidth per signal pair with the launch of the new VHDM-HSD 6-row module-to-backplane connector system from Molex.

Engineers can achieve up to 5.0Gbit/s bandwidth per signal pair with the launch of the new VHDM-HSD 6-row module-to-backplane connector system from Molex.

This product is ideal for connecting the main backplane to daughtercards in very high-speed, short rise-time, high-circuit count environments.

The new backplane is ideal for applications in the telecommunications, computer and instrumentation industries that include routers, switches, servers, storage equipment, transmission equipment and digital crossconnects.

VHDM-HSD systems provide enhanced electrical performance for differential signalling.

These advantages include reduced in-pair skew, reduced crosstalk and easier trace routing.

Ground planes between signal columns provide tightly controlled impedance for rise times down to 50ps (10-90%), ensuring very low crosstalk between signals within and between columns.

The daughtercard connector consists of a metal stiffener, as in the VHDM system, combining the signal wafers, power modules and guidance modules into one continuous connector that can be ordered as a single specific part number.

These 2.00 x 2.25mm pitch connectors have a real signal density of 10 differential pairs and added flexibility of 15.00mm minimum distance between daughtercards.

6-row VHDM-HSD wafers can be applied to the same stiffener as standard 6-row VHDM wafers.

VHDM and VHDM-HSD wafers grouped together in the same stiffener provide cost-effective solutions for different performance parameters.

Molex has licensed the VHDM-HSD technology from Teradyne.

With both Molex and Teradyne manufacturing identical connector systems, customers have two reliable supply sources.

Molex and Teradyne have codeveloped a website designed to help customers select VHDM-HSD products.

The web address is www.VHDM-HSD.com.

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