Flexible interposer provides faster interfaces

Low-profile contact interface combines Molex Copper Flex with Neoconix's HD+S PCBeam interposer for flex-to-PCBA applications.

With high-density high-speed applications in mind, Molex and Neoconix have collaborated to deliver a flexible copper-based high-density and speed (HD+S) interposer.

The low-profile contact interface integrates Molex Copper Flex with Neoconix's HD+S PCBeam interposer for flex-to-PCBA applications.

"Molex and Neoconix have come together to develop a highly-reliable interface that allows differential signal speeds greater than 10Gbit/s and single-ended speeds of 4GHz and higher", says Gary Manchester, Director of Marketing, Molex, Integrated Products division.

"With less than 3% crosstalk in a pin-matrix configuration, the Copper Flex assembly with PCBeam interposer will provide consistent, high-speed data transmission with minimal interference".

The Copper Flex assembly provides a variety of pin-matrix configurations, with densities of 1.00mm or less, to allow for board-to-flex pin counts of 500 I/Os or greater.

Single-piece compression and tool-less hardware interfaces are available; as well as an impedance matched system that offers 100ohm differential and 50ohm single-ended options.

PCBeam interposers feature all-metal spring beams that are permanently embedded onto an FR-4 substrate in a high-density configuration.

Photolithography and etch are used to define the contact elements, enabling design flexibility and true-position accuracy.

Typical configurations provide 0.152mm of true electrical compliance per side at 1.00mm pitch to ensure high reliability.

An innovative dual-beam option is also available to provide contact redundancy in high-reliability applications.

Copper Flex assemblies with PCBeam interposer are available in flexible cable lengths of 4 to 28in for complete design flexibility, and are offered in a variety of thicknesses and custom array of sises and footprints.

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