GameCube sparks 1T-SRAM demand
NEC has shipped more than 25 million 96Mbit high-density 1T-SRAMs in just one year since the launch of the Nintendo GameCube which uses these high-performance custom chips as its main system memory.
NEC has shipped more than 25 million units of 96Mbit high-density 1T-SRAM chips in just one year since the launch of the Nintendo GameCube which uses these very high-performance custom chips as its main system memory.
The companies revealed that they have extended NEC's license agreement for MoSys 1T-SRAM memory technologies for additional projects in embedded DRAM and logic processes with geometries down to 90nm.
Perrin Kaplan, Vice President, Marketing and Corporate Affairs at Nintendo of America said: "We are very pleased with the successful partnership we have with both NEC and MoSys, allowing us to leverage their technologies to produce a unique gaming experience with Nintendo GameCube for our customers".
"NEC is delighted to continue its long-term relationship with Nintendo with the achievement of this significant production milestone for the Nintendo GameCube", said Takashi Okuda, chief manager, of the System Memory Development Division at NEC Corp.
"MoSys is proud of its contribution to the success of Nintendo GameCube", commented Mark-Eric Jones, Vice President and General Manager of intellectual property at MoSys.
"These new NEC agreements build on the production success to broaden our relationship into additional processes and geometries".
The Nintendo GameCube includes 192Mbit of very high performance, low-latency 1T-SRAM as its main system memory to help achieve consistent graphics performance that provides customers with a unique gaming experience and simplifies the implementation of the latest video games by their creators.
Not what you're looking for? Search the site.
Categories
- Active Components (11,917)
- Passive Components (2,949)
- Design and Development (9,394)
- Enclosures and Panel Products (3,246)
- Interconnection (2,841)
- Electronics Manufacturing, Production, Packaging (3,055)
- Industry News (1,898)
- Optoelectronics (1,616)
- Power Supplies (2,297)
- Subassemblies (4,551)
- Test and Measurement (4,956)