Product category:
Microprocessors, Microcontrollers and DSPs
News Release from: Freescale Semiconductor
Edited by the Electronicstalk Editorial
Team on 13 April 2001
Motorola's 0.13-micron process is
densest CMOS
A new 0.13-micron CMOS process platform technology will enable Motorola Semiconductor Products Sector (SPS) to build system-on-chip solutions.
A new 0.13-micron CMOS process platform technology will enable Motorola Semiconductor Products Sector (SPS) to build system-on-chip solutions for wireless communication, networking/computing, intelligent home and transportation end markets Called HiPerMOS7 (or "HiP7"), this technology is commonly referred to as 0.13 micron but contains minimum features of 0.07um, and represents the densest, most modular CMOS platform in the industry
This article was originally published on Electronicstalk on 20 Mar 2001 at 8.00am (UK)
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"Implementing HiP7 will be a boon to designers of new electronic products as well as to consumers, enabling the creation of new products with higher performance, higher integration and more flexibility", said Padmasree Warrior, corporate vice president and chief technology officer for SPS.
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"Meanwhile, Motorola will benefit from the ability to develop semiconductors that are faster, cheaper and more efficient than products built on other technology platforms", Warrior said.
"Only a handful of global semiconductor companies have all that it takes to successfully launch a complete system-on-chip, and Motorola is one of them", Warrior said.
For example, design libraries, cores and modules such as embedded memory blocks, analogue, RF and specialised features such as SoI are all needed for true system-on-chip development - and all are now available in Motorola's technology portfolio to address HiP7 requirements and opportunities", she explained.
The HiP7 technology platform will support a wide range of products from low-cost, low-power parts for cellular phones to high-performance microprocessors.
The technology platform serves as the chassis on which various products are built.
A common technology platform can be used to manufacture a myriad of semiconductor products through the use of "plug-in modules" in the design and manufacturing process.
Motorola's modules support high-density embedded memories, high-precision analogue components, high-performance transistors and interconnects, efficient modular RF integration and an SoI module to enable high-performance, lower-power designs.
Examples of future products include baseband chips used in cellular phones, digital signal processors used in wireless infrastructure applications such as routers, and PowerPC microprocessors used in computing applications.
HiP7 will enable system-on-chip configurations that integrate analogue and high-frequency RF blocks on the same chip as the digital logic.
This will reduce overall system cost.
Motorola is currently running embedded microprocessors on this new 0.13-micron process.
Volume production will begin in Q2 of this year in Motorola's MOS13 Austin, TX facility.
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