Integrated power amp incorporates 50ohm matching

Motorola's Semiconductor Products Sector has a revolutionary concept allowing the design of cost- and size-efficient power amplifier (PA) solutions.

Motorola's Semiconductor Products Sector has a revolutionary concept allowing the design of cost- and size-efficient power amplifier (PA) solutions.

The high-impedance integrated power amplifier (HIIPA) changes the paradigm of traditional 50ohm modules, where passive components are added as discrete devices onto a printed circuit board with a power amplifier die.

The HIIPA concept provides a 50ohm solution without the need for additional passive components.

The 50ohm matching at the output of the die is accomplished with capacitors and inductors.

The capacitors are integrated onto the die, and the inductors are implemented by wire bonds of variable lengths.

The tolerance of the capacitor values, together with the precision of the wire bonding process, allow a matching value with less dispersion than using passive components on a radio board.

The first product using this concept is expected to be a quad-band GSM/GPRS power amplifier module called the MMM5062.

This PA module builds on a previously developed product (MRFIC1869) by using the same enhancement-mode (E-mode) GaAs technology.

E-mode is a true single supply technology, eliminating the need for a negative voltage generator.

"We are very excited to again demonstrate Motorola's leadership in radio frequency technologies and expertise with the HIIPA concept.

This concept creates a cost effective solution for the radio designers by combining high performance E-mode GaAs technology with very innovative circuit and package design techniques", said Behrooz Abdi, vice president and general manager of Motorola's Radio Products Division.

"We are also very pleased with the response of our customers.

They are delighted to have a 50ohm solution at a more competitive price than modules that use traditional passive components for matching".

The wide band matching advantage brought by the HIIPA concept is used to provide a flexible PA solution that is able to adapt to GSM/GPRS application requirements.

It is suitable for triple-band GSM/GPRS for European applications, dual or triple-band GSM/GPRS for US solutions, and quad-band to cover both European and North American markets.

The MMM5062 is expected to be housed in a 7 x 7mm package with a height of less than 1.11mm.

This package is expected to set a new standard in volume (0.05cm3) and to allow a very small quad band GSM/GPRS PA solution, which can use either open loop (drain control) or closed loop (gate control) options.

Prototype samples and fully assembled demo boards are currently available, with volume production planned in the first half of 2002.

(This was Electronicstalk's Top Story on 7 December 2001).

Back to top