Product category:
Microprocessors, Microcontrollers and DSPs
News Release from: Freescale Semiconductor
Edited by the Electronicstalk Editorial
Team on 18 April 2002
Big three to drive geometry down to 32nm
Three of the world's top ten semiconductor manufacturers are to create a comprehensive alliance dedicated to breakthrough semiconductor technology development.
Three of the world's top ten semiconductor manufacturers have signed a memorandum of understanding proposing to create a comprehensive alliance dedicated to breakthrough semiconductor technology development The unprecedented move redefines the industry model for such advanced development, with the goal of creating future-generation technologies and system-on-chip solutions more quickly and cost-effectively
This article was originally published on Electronicstalk on 20 Mar 2001 at 8.00am (UK)
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The alliance joins together three of the world's leading industry players in semiconductor research and process development - STMicroelectronics, Motorola and Philips - and would include the participation for process development and alignment of the world's largest semiconductor foundry, TSMC.
The joint development programme will be based in Crolles, France, in the new Crolles2 R and D Centre, and augmented by each company's existing R and D operations and laboratories.
In addition, to further support the alliance, CEA/LETI will increase its research efforts in the Grenoble, France, labs.
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Motorola joins Philips and ST in the 300mm wafer Crolles2 project, significantly enhancing the strength of the existing alliance.
This expands the agreement announced last month by Philips, ST and TSMC to jointly develop CMOS process technology.
The combined resources of the four companies will be dedicated to development of future generations of CMOS technology from the 90nm node down to 32nm over the next five years.
Such reduced circuit geometry sizes will allow the partners to continue to meet customer demand for integrating more intelligence into smaller packages.
Motorola brings to the alliance its portfolio of leading-edge technologies, including SOI (silicon-on-insulator) and embedded MRAM technologies as well as its knowhow in advanced copper interconnect.
This contribution builds upon the existing Philips and ST co-operation for core CMOS processes, which includes embedded DRAM, SRAM and analogue CMOS.
The expanded commitment and access to 300mm pilot capacity at the Crolles site will allow for rapid introduction of the partners' new products.
Motorola, Philips and STMicroelectronics will be equal technology partners in the Crolles2 alliance in terms of capital expenditure, R and D costs and wafer load for the fab.
Their joint investment will total $1.4 billion by 2005.
TSMC will be a valued participant to achieve alignment of CMOS platform technology between the alliance and TSMC's commercial foundry process.
"Motorola continues to view the future as bright for semiconductor opportunities.
This investment will ensure that Motorola and its partners are in leadership positions to supply the highest-value products to our customers", said Fred Shlapak, president of the Semiconductor Products Sector at Motorola.
"The beauty of this alliance is that it will dramatically accelerate the development of future technologies, ensure proliferation of those technologies throughout the industry, and at the same time result in lower costs for each member of the joint development project.
For Motorola, this kind of teamwork is a critical element for our asset-light strategy".
"The fact that Motorola has joined with us in the development of future semiconductor process and manufacturing technologies is a testament to the level of success that has already been achieved by Philips, STMicroelectronics and the various research institutes involved in the Crolles2 project", said Scott McGregor, CEO of Philips Semiconductors.
"Being part of this comprehensive alliance in breakthrough technology development will put us in an unprecedented position to deliver the silicon system solutions that help people effortlessly connect to information, entertainment and services".
"The partnership that we are building around the Crolles Centre with Philips, Motorola and TSMC is unique and again demonstrates ST's unsurpassed ability to federate leading-edge expertise from all over the world to fulfil ST's mission to provide customers with strategic independence.
In addition to ensuring that ST's R and D continues to be world-class, the partnership will also reinforce the position of Crolles as one of the world's leading centres of excellence for developing the semiconductor technologies that will drive the market recovery", said Pasquale Pistorio, President and CEO of STMicroelectronics.
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