Product category:
Discrete Power Devices
News Release from: Freescale Semiconductor
Edited by the Electronicstalk Editorial
Team on 23 May 2005
Plastic-packaged power transistors prove
popular
Freescale Semiconductor has now shipped more than 10 million high-power, high-frequency RF power transistors in plastic packages.
Freescale Semiconductor has now shipped more than 10 million high-power, high-frequency RF power transistors in plastic packages Freescale's advanced TO Series RF power plastic packaging provides an economical, reliable and robust alternative to conventional metal-ceramic packaging for cost-sensitive RF applications, such as cellular basestation amplifiers supporting GSM, Edge, CDMA and W-CDMA technologies
This article was originally published on Electronicstalk on 20 Mar 2001 at 8.00am (UK)
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Freescale offers the industry's broadest portfolio of RF power plastic packages, with 10 package outlines to choose from.
The plastic packages are designed specifically for high-power RF applications and to deliver output power as high as 130W and frequencies above 2GHz.
"Freescale not only pioneered the development of high-power RF packaging to meet the demanding requirements of power amplifier manufacturers, but we continue to set the pace in plastic package performance, temperature ratings, reliability and volume production", said Gavin Woods, Vice President and General Manager of Freescale's RF Division.
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"Shipping more than 10 million RF power plastic devices underscores the broad market acceptance of Freescale's plastic packaging technology".
"We are one of the few silicon suppliers to offer RF transistor capabilities in plastic that are comparable to metal-ceramic".
Freescale's heritage of plastic packaging leadership spans more than 30 years.
In the mid-1980s the company pioneered low-frequency, high-power plastic packaging for the automotive and industrial industries.
Leveraging its innovative, high-performance plastic technology, in 1997 Freescale delivered the industry's first high-power, high-frequency RF devices in plastic packages optimised for wireless infrastructure applications.
In 2003, Freescale introduced the first 2GHz RF power plastic devices with a maximum junction temperature rating of 200C, which for the first time matched the junction temperature capability of traditional RF transistors in metal-ceramic packages.
In developing its high-power plastic package technology, Freescale applied the same rigorous quality, reliability and industry-standard testing practices used for low-frequency power plastic packaging in under-the-bonnet automotive applications.
Freescale has added features to make its plastic packages comparable to metal-ceramic packaging in terms of frequency, thermal performance, maximum junction temperature, standards compliance and reliability.
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