Product category:
Microprocessors, Microcontrollers and DSPs
News Release from: Freescale Semiconductor
Edited by the Electronicstalk Editorial
Team on 12 February 2007
3G and related wireless technologies on
show
Visitors to 3GSM World Congress this week have the opportunity to see one of the broadest displays of 3G and related wireless technologies at the Freescale Semiconductor booth.
Visitors to 3GSM World Congress this week have the opportunity to see one of the broadest displays of 3G and related wireless technologies at the Freescale Semiconductor booth More than 20 Freescale and partner demos will showcase the company's array of integrated platform solutions for mobile communications and entertainment
This article was originally published on Electronicstalk on 20 Mar 2001 at 8.00am (UK)
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"Our focus this year at 3GSM is to demonstrate the technological advances we have made in 3G", said Sandeep Chennakeshu, Senior Vice President and General Manager, Freescale's Wireless and Mobile Systems Group.
"From infrastructure to handset, Freescale provides state-of-the-art solutions to support multiple wireless applications".
Freescale's demonstrations at 3GSM World Congress, one of the largest exhibitions for the mobile industry, will showcase a variety of technologies, including MXC, the world's first single core modem; applications processors for mobile multimedia and infotainment; RFCMOS 90nm ASICs for 2G and 3G handsets; and advanced RFIC technologies designed to support the rapidly changing infrastructure market.
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3G handset solutions feature streaming video, audio at high datarates High speed uplink packet access (HSUPA) and high speed downlink packet access (HSDPA) technology will be featured in the Freescale booth.
This technology, developed in collaboration with Motorola, is designed to operate at up to 5.6Mbit/s for HSUPA and 7.2Mbit/s for HSDPA and uses an actual handset, not an engineering test box.
Another demonstration will showcase a 3G handset conducting a simultaneous voice and data call (multicall capability) over a live HSDPA network.
Redistributed chip packaging (RCP), Freescale's advanced semiconductor packaging technology, will also be on display.
RCP is a revolutionary proprietary technology that could replace ball grid array and flip chip as preferred packaging technology for highly miniaturised devices, such as smartphones and multimedia players.
RF technology solutions for reduced test time for handset manufacturers Also planned to be showcased in the Freescale booth will be the RFX300-30 3G subsystem and RFX275-30 2.75G subsystem.
Key benefits of these advanced devices include high integration to reduce eBOM and a design to simplify layer-one programming, reduce test time and increase yield.
Freescale will showcase an innovative high power product line of RF Integrated Circuits (RFICs) designed to deliver unprecedented levels of high gain at the 100W power level for wireless basestations serving GSM, Edge, CDMA, WCDMA and TD-SCDMA networks.
Also anticipated to be featured is the latest product line in LDMOS RF power devices for all three bands of WiMAX communication standards.
As the WiMAX standard gains momentum around the world, communications processors from Freescale Semiconductor are driving the rapid deployment of cost effective WiMAX customer premises equipment (CPE) products and basestation installations.
At 3GSM, Freescale intends to announce a significant WiMAX design win and demonstrate how its industry-leading processors based on Power Architecture technology are advancing the state of the art for WiMAX technology.
On display will be Freescale popular i.MX family of multimedia applications processors as it powers many advanced mobile multimedia and infotainment experiences.
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