Product category:
Heatsinks and Thermal Management
News Release from: MRC Components | Subject: CTS heatsinks
Edited by the Electronicstalk Editorial
Team on 23 October 2006
Low-profile heatsinks cool tightly
spaced boards
When compared with other heatsinks of equivalent size, low-height forged heatsinks have better thermal performance.
Available now from MRC Components is a low-height thin-fin forged heatsink from CTS Board space constraints and increased demands for thermal management control are challenges that engineers must consider with each new application
This article was originally published on Electronicstalk on 29 Jan 2003 at 8.00am (UK)
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Thermal management must be considered throughout project development.
Efficient thermal management through the use of heatsinks is often compromised by the space constraints imposed on the system design team.
Lower profile passive heatsinks offer a needed solution to these space limitations.
When compared with other heatsinks of equivalent size, low-height forged heatsinks have better thermal performance.
The CTS/IERC line of products now includes the APF Series thin-fin lower-height forged heatsink.
The APF Series heatsink is available in three heights - 6.3, 9.5 and 12.7mm - and in three footprints - 19, 30 and 40mm square.
The heatsink can be easily attached to BGA, PGA, PLCC and QFP packages with thermally conductive peel and stick tape.
CTS/IERC A01 tape is a preferred method for most applications and CTS/IERC engineering can be contacted for advice on any special application requirements.
These heatsinks provide a solution previously not available for applications with tight spacing.
PCI expansion card slot-spacing of 0.8in for motherboards, is an example where heatsink heights of less than 0.5in with thermal resistances as low as 1.90C/W can provide a performance advantage for thermal management.
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