Embedded Flash suits memory-hungry devices

New from M-Systems, DOC H3 is the company's next generation embedded Flash drive (EFD) based on a DiskOnChip architecture.

New from M-Systems, DOC H3 is the company's next generation embedded Flash drive (EFD) based on a DiskOnChip architecture.

DOC H3 solves complex NAND media issues allowing for a quick integration of the latest and most cost-effective NAND Flash media into mobile handsets and consumer electronics devices.

DOC H3 offers boot capabilities and allows for a faster time to market from inception to production, crucial for today's demanding product design cycles.

DOC H3 is most suitable for memory-hungry devices such as multimedia mobile handsets, digital music players, GPS devices, portable media players and car infotainment systems.

DOC H3 features an advanced controller with execute in place (XIP) boot capabilities and a built-in version of M-Systems' patented TrueFFS Flash management software running internally as firmware from within the device.

The result is a plug-and-play storage device, which practically eliminates the inherent difficulties of raw NAND media integration, providing a standard, self-contained storage solution, requiring virtually zero software support.

"As NAND Flash vendors continue to push higher densities at lower costs, they are breaking compatibility with legacy NAND devices".

"As a result, OEMs can be limited to relatively older NAND devices while the newer, more cost-effective Flash devices are not supported by popular chipsets without additional firmware or other modifications", said Joseph Unsworth, Semiconductor Memory Senior Analyst for Gartner.

"The ability to have a simple, self-contained solution that is interoperable with the latest NAND Flash devices from several sources will prove attractive to OEMs to satisfy their data storage needs while providing the reliability inherent to NOR Flash".

"As penetration of embedded Flash drives into mainstream handsets and consumer electronics devices increases, they must offer a simple and stable interface to eliminate the need for massive investments in engineering and support, typical with NAND Flash media implementation", said Dov Moran President and CEO of M-Systems.

"DOC H3 answers these needs by providing an easy and standard integration process".

"In addition, M Systems' strategic Flash supply agreements enable access to cost-effective NAND Flash media from multiple sources, thus enabling us to overcome possible supply chain risks".

M-Systems' strategic Flash supply agreements enable utilisation of the most advantageous Flash technologies available per given density.

In addition, the advanced controller design and built-in TrueFFS Flash management technology improve on the basic capabilities of raw Flash media, offering low power consumption, superior performance and strong security features.

"The new DiskOnChip H3 architecture enriches the ecosystem we are building for our customers by making integration and testing of the latest raw Flash technologies with TI's family of OMAP processors and OMAP-Vox solutions virtually effortless", said Markus Tremmel Worldwide Manager of Texas Instruments' Cellular Systems Ecosystem.

"It will help our customers focus their efforts on making superior products, faster".

Engineering samples of DOC H3 will be available in the first quarter of 2006, with availability for mass production planned for the second quarter.

It will be available in densities of 128Mbyte (1Gbit) to 2Gbyte (16Gbit), in 9x12 and 12x18 FBGA packages and will have the capability to work at 1.8 and 3.3V.

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