Product category:
Memory Devices and Modules
News Release from: M-Systems | Subject: DOC H3
Edited by the Electronicstalk Editorial
Team on 06 January 2006
Embedded Flash drive promises easy
integration
Hynix Semiconductor and M-Systems are collaborating on their first-ever jointly introduced embedded Flash drive based on field-proven DiskOnChip architecture.
Hynix Semiconductor and M-Systems are collaborating on their first-ever jointly introduced embedded Flash drive (EFD) - the DOC H3, based on the field-proven DiskOnChip architecture The DOC H3 is designed to be a self-contained EFD with M-Systems' TrueFFS Flash management software running internally as firmware from within the Flash controller inside the chip
This article was originally published on Electronicstalk on 9 Dec 2005 at 8.00am (UK)
Related stories
Embedded Flash suits memory-hungry devices
New from M-Systems, DOC H3 is the company's next generation embedded Flash drive (EFD) based on a DiskOnChip architecture.
Embedded Flash drive is optimised for new XScale
M-Systems is to provide mobile product designers with a virtually plug-and-play ability to tap into the latest multilevel cell NAND Flash technology on Intel's newest processor family.
This architecture is designed to minimise overall system integration complexity and help reduce end-product design cycles by offering mobile handset and consumer electronics device manufacturers a virtually plug-and-play EFD.
"We are truly excited to announce the first jointly introduced fruit of our recently established partnership with Hynix, a world leader in memory technology".
"Hynix's adoption of DOC H3 sends a strong endorsement signal to the industry on behalf of our DiskOnChip architecture and is definitely exciting news for mobile handset and Consumer electronics device manufacturers", said Dov Moran, President and CEO of M-Systems.
Further reading
Embedded Flash drive enters mass production
M-Systems has commenced mass production of the mDOC H3 embedded Flash drive (EFD) and will start shipping to top-tier customers for their high-volume mobile projects.
DiskOnChip doubles Flash storage density
M-Systems has released the 1Gbit Mobile DiskOnChip G3, its second multilevel cell (MLC) NAND-based product.
"This new collaboration also represents a first jointly announced embodiment of our firm commitment to providing our customers with multiple sources for DiskOnChip architecture-based EFDs".
"As a result of this joint development effort, our customers will now have the assurance and peace of mind of having an additional, reliable and robust source for easy-to-integrate, high-density, quality EFDs containing the optimum Flash technology from Hynix".
"We at M-Systems certainly look forward to the continuation of this very promising collaboration with Hynix".
"We are very pleased to announce our first jointly introduced product with MSystems".
"DOC H3 provides us with the ability to expand our product offering for the mobile handset and consumer electronics devices markets", said CS Oh, COO of Hynix.
"By combining our latest Flash technology with M-Systems' advanced technology, we can now offer our customers an immediate path to the benefits of our most advanced technology and cost competitive solution".
"We at Hynix anticipate this fruitful partnership to yield many more such jointly developed products in the future".
Engineering samples of DOC H3 will be available in the first quarter of 2006, With availability for mass production planned for the second quarter.
It will be available in densities from 128Mbyte (1Gbit) to 2Gbyte (16Gbit), in 9x12 and 12x18 FBGA packages and will have the capability to work at both 1.8 and 3.3V.
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