Product category:
IC and Hybrid Processing Equipment
News Release from: NanoVia | Subject: MultiDice
Edited by the Electronicstalk Editorial
Team on 11 September 2002
Laser delivery system provides speedy
dicing
NanoVia has developed a novel optical beam delivery system specifically tailored to improving the throughput of laser-based semiconductor wafer dicing processes.
NanoVia has developed a novel optical beam delivery system specifically tailored to improving the throughput of laser-based semiconductor wafer dicing processes Using a patent pending dual and triple wavelength technology, the MultiDice platform provides preremoval of first layer materials, including low-k dielectric and other coatings that are either brittle or at risk of damage due to specific laser wavelengths
This article was originally published on Electronicstalk on 18 Dec 2002 at 8.00am (UK)
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NanoVia has solved a variety of machine vision applications, previously deemed impossible, for the microelectronic, telecomms, MEMS and semiconductor industries.
NanoVia's latest optical system MultiDice will use a laser with multiple UV and IR wavelengths.
Present tests show potential increased throughput of 60% over current dicing methods, with a projected target of nearly 100% with newer high power lasers being developed by its laser vendor.
Anticipating the need for extreme high-speed processes to support the HDI roadmap in the USA and in Asia, NanoVia has made its top priority the development of new technologies to meet the demands of the HDI marketplace; most specifically in IC packaging processes.
The MultiDice technology is a hybrid design using portions of existing elements from NanoVia's current line of patented and patent-pending optical systems for micro via drilling, IC memory repair and SMD trimming, including NanoVia's latest HyperVia technology.
"NanoVia is targeting growth markets and bring technology that can meet the demand for increase throughput", explains Todd Lizotte, VP of R and D at NanoVia.
"The 300mm wafer market needs updated processes from wafer dicing to the packaging of the ICs".
He concludes, "Our goal is to work with partners to bring this technology to market in a timely manner".
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