Product category:
IC and Hybrid Processing Equipment
News Release from: NanoVia | Subject: VectorLinx
Edited by the Electronicstalk Editorial
Team on 11 September 2002
Beam delivery aids IC modification
processes
A novel optical beam delivery system from NanoVia aims to improve the throughput of laser-based memory and IC repair and/or modification processes.
A novel optical beam delivery system from NanoVia aims to improve the throughput of laser-based memory and IC repair and/or modification processes Preliminary tests show that by adding elements of NanoVia's patent-pending design to existing systems currently in use, unprecedented gains can be achieved in throughput
This article was originally published on Electronicstalk on 3 Oct 2002 at 8.00am (UK)
Related stories
Optical system has designs on thin films and OLEDs
NanoVia has developed an optical system design targeting the high-volume manufacture of OLED display devices.
Laser delivery system provides speedy dicing
NanoVia has developed a novel optical beam delivery system specifically tailored to improving the throughput of laser-based semiconductor wafer dicing processes.
Optical platform targets wafer-scale technology
UltraVia is an optical system configuration adapted to efficiently drill high aspect ratio vias and microvias into silicon substrates for wafer scale packaging applications.
NanoVia has named its latest optical system VectorLinx and will begin development of a full test bed to demonstrate the control system architecture and lifetime testing of key elements.
With the help of its key laser vendor, NanoVia will demonstrate ultra high-speed processing in the UV and IR wavelengths on industry standard materials, as well as lower-end applications involving trimming of surface mount devices.
Preliminary tests show potential increased throughput of 50% and further controls design will bring this to the 100% mark.
Anticipating the need for extreme high-speed processes to support the HDI roadmap in the USA and in Asia, NanoVia has made its top priority the development of new technologies to meet the demands of the HDI marketplace; most specifically in IC yield and IC chip packaging processes.
The VectorLinx technology is a hybrid design using portions of existing elements from NanoVia's current line of patented and patent-pending optical systems for micro via drilling, nozzle drilling and wave guide fabrication, including NanoVia's latest HyperVia technology.
"NanoVia is committed to designing, building and delivering solutions that will jump-start the HDI marketplace in the United States", explains Todd Lizotte, VP of R and D at NanoVia.
"The high density market is demanding throughput solutions.
We have been expecting these demands, and we are committed to working with industry partners to lead the way".
He concludes, "Our determination to return American technologies to the forefront is unwavering".
• NanoVia: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
