Product category:
IC and Hybrid Processing Equipment
News Release from: NanoVia
Edited by the Electronicstalk Editorial
Team on 03 October 2002
NanoVia looks for partners
NanoVia is discussing options with several of the industry's top semiconductor equipment manufacturers.
NanoVia is discussing options with several of the industry's top semiconductor equipment manufacturers as part of its strategy to enable traditional tool manufacturers access to the latest in laser-based memory and IC repair and laser-based semiconductor dicing and trimming for 300mm wafer applications Recent conversations with several existing semiconductor equipment manufacturers suggest that those outside the laser market are looking for opportunities to add laser solutions to their equipment offerings
This article was originally published on Electronicstalk on 18 Dec 2002 at 8.00am (UK)
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Late summer 2002 announcements regarding NanoVia's HyperVia, VectorLinx and MulitDice optical systems sparked tremendous industry interest, setting off a whirlwind of inquiries.
"We're grateful that the value of our technology is being recognized", acknowledges S Collar Waters, President of NanoVia.
"It is so widely applicable, we're confident that will set the pace in all of its targeted markets".
Current negotiations will help bring to fruition NanoVia's plans for its own optics fabrication facility under it's subsidiary, 3G Optics.
"Our strategy has always been two-fold", explains Todd Lizotte, Vice President of R and D at NanoVia, LP.
"First, to build our patent portfolio through the research and development of high speed laser based processes and optical systems.
Second, to control the destiny of that intellectual property by keeping the core product fabrication in-house.
We have remained dedicated to that vision".
"Having our own fab facility can only strengthen us", adds Lizotte.
"Once the obstacles presented by outside vendors are eliminated, NanoVia and its technology partners will be in the forefront for years to come".
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