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Product category: IC and Hybrid Processing Equipment
News Release from: NanoVia
Edited by the Electronicstalk Editorial Team on 19 November 2002

Laser-based drilling technology licensed

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NanoVia has closed an exclusive deal on its CO2-laser-based HyperVia microvia drilling technology.

NanoVia has closed an exclusive deal on its CO2-laser-based HyperVia microvia drilling technology NanoVia has always positioned itself in growth market areas and with this latest agreement; NanoVia has accomplished its 2002 goals for licensing within its High Density Interconnect Business Unit

With the CO2 iteration of its HyperVia optical system wrapped up, NanoVia is now poised to charge into the field of memory repair and yield management to directly challenge its US competitors through strategic alliances, partnerships and joint venture opportunities.

The most likely targets of these relationships are semiconductor tool builders who recognise that laser yield management is imperative, especially as the semiconductor market ramps up the 100-million-plus transistor level in memory and processors.

The implementation of 300mm wafer sizes will only serve to increase this need, as well.

Non-laser-system manufacturers have seen a great opportunity to enter this market by way of a NanoVia partnership, since the VectorLinx has a potential of increasing memory repair throughput by a factor of 3X.

"Leveraging our optical and laser solutions know-how with existing manufacturers of semiconductor or laser processing equipment is our goal", explains Todd Lizotte, Vice President of R and D at NanoVia, LP.

"We believe the yield management market is not being adequately served by the current leading suppliers.

The United States must keep pace as a developer of new technology, and with transistor densities approaching the 1 billion mark within the next 10 years, the semiconductor industry needs equipment providers willing to make innovation the top priority.

This is our quest".

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